Soft Magnetic Shielding Can for Semiconductor Package EMI Reduction
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Solution Overview
Problem
Semiconductor packages face electromagnetic interference (EMI) issues due to undesirably radiated or conducted electromagnetic signals, which can disturb the operation of adjacent elements and lower circuit performance, leading to malfunctions.
Innovation Solution
A semiconductor package is designed with a shielding can made of soft magnetic material, such as iron oxide combined with metals like nickel, zinc, or copper, which is electrically connected to conductive elements and surrounds the semiconductor chips, including a metal layer and insulating adhesive layer, to effectively absorb EMI. This shielding can also be connected to ground wires through vias for enhanced EMI reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding can is added to reduce EMI, then electromagnetic interference protection is improved, but device complexity increases
Solution Approach 1:
The shielding can is integrated within the semiconductor package structure, nesting the EMI shielding function inside the existing package housing. This allows the shielding can to be contained within the overall device footprint without adding external complexity, effectively reducing EMI while maintaining a compact form factor.
Solution Approach 2:
The shielding can is constructed using composite material layers including conductive material, magnetic material, and insulating material. This multi-layer composite structure provides effective EMI shielding through combined electromagnetic reflection, absorption, and isolation mechanisms, achieving superior protection without requiring a single thick material that would increase size.
2Object-affected harmful factors
If the shielding can is made thicker to improve EMI shielding, then EMI protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The shielding can wall is divided into multiple thin layers (conductive layer, magnetic layer, insulating layer) rather than using a single thick wall. Each layer has a controlled thickness within ±5μm tolerance, and the cumulative effect of these segmented layers achieves the required EMI shielding performance while maintaining manufacturability and reducing the need for extreme precision in any single layer.
Solution Approach 2:
The multi-layer composite structure distributes the EMI shielding function across different material layers, each optimized for specific shielding mechanisms (reflection, absorption, isolation). This approach achieves effective EMI protection with moderate thicknesses, avoiding the need for extremely thick single-layer shields that would demand impractical manufacturing precision.
3Object-affected harmful factors
If the shielding can is electrically connected to ground wires through vias, then EMI reduction is improved, but device complexity increases
Solution Approach 1:
Ground vias serve as intermediary elements that electrically connect the shielding can to the ground wires. These vias act as conductive bridges, providing a low-impedance path for electromagnetic noise to reach ground potential. This intermediary connection enhances EMI reduction effectiveness while adding minimal structural complexity compared to direct bonding methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces EMI by up to 5 dB when connected to ground wires, improving the operational reliability and performance of semiconductor packages by effectively absorbing electromagnetic noise in multiple directions.
Implementation Method 1
The shielding can comprises a soft magnetic material... effectively absorb EMI... significantly reduces EMI by up to 5 dB
Implementation Method 2
effectively absorb EMI... effectively absorbing electromagnetic noise in multiple directions
Data Source
AI summary
A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI).