Semiconductor Device Shielding with Connector Portion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices become smaller and more functional, electromagnetic noise generated by one semiconductor device can degrade the reliability of other semiconductor devices, leading to reduced performance and reliability.
Innovation Solution
A semiconductor device design featuring a first and second metal lead frame portion with a semiconductor chip mounted on the first, and a connector portion made of conductive materials like copper or aluminum that covers the chip to shield against electromagnetic noise, with specific gap sizing to prevent dielectric breakdown and enhance shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a connector portion is added to cover the semiconductor chip for electromagnetic shielding, then electromagnetic noise blocking is improved, but device complexity increases
Solution Approach 1:
The connector portion is merged with the lead frame structure, integrating the electromagnetic shielding function into the existing packaging framework. The connector portion extends from the lead frame and covers the chip while maintaining electrical connections, thus adding shielding capability without requiring a completely separate shielding structure.
Solution Approach 2:
The connector portion serves multiple functions: it provides electromagnetic shielding, maintains electrical connections, and structurally supports the chip mounting. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving effective noise blocking.
2Reliability
If gap size is reduced to prevent dielectric breakdown, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies optimized gap dimension parameters (e.g., gap width of 0.1-0.5mm) that balance dielectric breakdown prevention with manufacturing feasibility. By establishing specific parameter ranges for gap sizes, the design achieves reliable electrical insulation while remaining compatible with standard manufacturing tolerances.
Solution Approach 2:
The resin material acts as an intermediary dielectric substance filling the gaps between conductive portions. This intermediary layer provides electrical insulation and prevents dielectric breakdown while accommodating reasonable manufacturing variations in gap dimensions, thus reducing the stringency of precision requirements.
3Object-affected harmful factors
If conductive materials are used for shielding, then electromagnetic noise blocking is improved, but cost increases
Solution Approach 1:
Conductive materials are applied locally only where electromagnetic shielding is most critical - specifically in the connector portion covering the chip area and at strategic lead frame locations. This localized application provides effective noise blocking while minimizing the total quantity of expensive conductive materials required, thus controlling cost.
Solution Approach 2:
The patent employs composite material structures combining conductive materials with insulating resins and substrate materials. This composite approach optimizes the shielding effectiveness-to-cost ratio by using conductive materials only where necessary for electromagnetic protection, rather than uniformly applying them throughout the entire device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively blocks electromagnetic noise, improving the reliability of semiconductor devices by using conductive materials for shielding and optimizing gap sizes to prevent dielectric breakdown, thereby enhancing the overall performance and reliability of the devices.
Implementation Method 1
a connector portion electrically connected to a second metal lead frame part and attached to a second surface of the semiconductor chip. The connector portion covers an entirety of a planar area of the semiconductor chip when viewed along a direction orthogonal to a second surface of the semiconductor chip
Implementation Method 2
with specific gap sizing to prevent dielectric breakdown and enhance shielding effectiveness
Data Source
AI summary
A semiconductor device comprises a first metal lead frame portion with a chip mounting surface, a second metal lead frame portion, and a semiconductor chip with a first surface facing and attached to the chip mounting surface of the first metal lead frame part and a second surface facing away from the chip mounting surface of the first metal lead frame part. A connector portion is electrical connected to the second metal lead frame portion and is attached to the second surface of the semiconductor chip. The connector portion covers the entirety of a planar area of the semiconductor chip when viewed along a direction orthogonal to second surface of the semiconductor chip.