Semiconductor Package Shielding Member for EMI Isolation
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Solution Overview
Problem
Conventional semiconductor packages fail to effectively eliminate electromagnetic interference between radio frequency chips and other electronic elements, leading to signal errors despite external protection from metal thin films.
Innovation Solution
A semiconductor package design that includes a substrate with semiconductor elements, a shielding member placed between these elements, and an encapsulant covering both, along with a metal layer made of copper, nickel, iron, or stainless steel to prevent electromagnetic interference, where the shielding member is exposed and electrically connected to the substrate's circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal thin film is formed on the encapsulant to protect from external EMI, then external electromagnetic interference protection is improved, but internal electromagnetic interference between semiconductor elements cannot be eliminated
Solution Approach 1:
The patent divides the shielding function into two segments: an outer metal thin film for external EMI protection and internal shielding members positioned between semiconductor elements for internal EMI prevention. This segmentation allows each shielding component to address specific interference sources independently, resolving the contradiction between external protection and internal interference elimination.
Solution Approach 2:
The patent applies different shielding structures at different locations: a continuous metal thin film covers the entire outer surface for external protection, while discrete shielding members are strategically placed between specific semiconductor elements that generate internal interference. This local quality approach optimizes shielding effectiveness for each specific interference scenario.
2Object-generated harmful factors
If shielding members are added between semiconductor elements to prevent internal EMI, then internal electromagnetic interference is eliminated, but device complexity increases
Solution Approach 1:
The patent employs thin film shielding members that can be conformally deposited between semiconductor elements using vapor deposition techniques. These thin film structures provide effective EMI shielding while occupying minimal space and adding minimal structural complexity compared to bulk shielding materials.
Solution Approach 2:
The shielding members serve multiple functions: they block internal EMI between semiconductor elements, provide a reference ground plane for signal stability, and can be electrically connected to existing package grounds. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electromagnetic interference between semiconductor elements, such as Bluetooth and Wi-Fi chips, by using a shielding member and metal layer to isolate and shield them from signal interference.
Implementation Method 1
at least a shielding member disposed on the substrate and between at least two of the semiconductor elements
Implementation Method 2
a metal layer is further formed on the encapsulant, electrically connected with the shielding member, and made of copper, nickel, iron, aluminum, or stainless steel
Data Source
AI summary
This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.