Semiconductor Package Shielding Layer with Heat Dissipating Vias
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face issues with electromagnetic wave leakage and reduced heat transfer performance due to the use of electromagnetic wave absorbing materials with low thermal conductivity, such as ferrite particles, which hinder effective electromagnetic shielding and heat dissipation.
Innovation Solution
A semiconductor device configuration that includes an electromagnetic wave absorbing layer made of resin containing magnetic particles or carbon, combined with an electromagnetic wave reflecting layer made of resin with conductive particles, covering the semiconductor package except for the surface bonded to the circuit board, and the reflecting layer is electrically connected to the ground electrode, enhancing both electromagnetic shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the semiconductor package is covered with a metal can to shield electromagnetic waves, then electromagnetic wave shielding is improved, but the mounting area is increased and mutual interference occurs among electronic components
Solution Approach 1:
The patent applies electromagnetic wave absorbing materials in the form of thin coating layers (first and second electromagnetic wave absorbing layers) instead of bulky metal cans. These thin film structures provide effective electromagnetic shielding while occupying minimal space, thus resolving the contradiction between shielding performance and mounting area constraints.
Solution Approach 2:
The patent uses composite electromagnetic wave absorbing materials comprising magnetic particles, conductive particles, and resin. This composite structure achieves effective electromagnetic wave absorption and shielding without requiring thick metal layers, thereby reducing the mounting area while maintaining shielding effectiveness.
2Object-affected harmful factors
If the semiconductor package is covered with an electromagnetic wave absorbing material, then electromagnetic wave absorption is improved, but heat transfer performance is reduced due to low thermal conductivity
Solution Approach 1:
The patent employs a composite material system where magnetic particles (for electromagnetic wave absorption), conductive particles (for heat conduction), and resin (as binder) are combined. The conductive particles specifically address the thermal conductivity deficiency of traditional electromagnetic wave absorbing materials, enabling simultaneous achievement of electromagnetic wave absorption and heat dissipation functions.
Solution Approach 2:
The electromagnetic wave absorbing layers are designed to perform multiple functions simultaneously: absorbing electromagnetic waves (via magnetic particles), conducting heat (via conductive particles), and providing structural integrity (via resin). This multi-functionality resolves the contradiction between electromagnetic wave absorption and heat transfer performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high electromagnetic wave shielding effectiveness while efficiently dissipating heat from the semiconductor package, reducing electromagnetic interference and improving thermal conductivity compared to previous materials.
Implementation Method 1
Such an electromagnetic wave absorbing material exhibits an effect of absorbing electromagnetic waves by converting electromagnetic wave energy into thermal energy.
Implementation Method 2
the conductive resin exhibits an effect of reflecting electromagnetic waves.
Implementation Method 3
the thermal conductivity (λ) of the ferrite particles contained in the electromagnetic wave absorbing material is 1 to 5 W/(m·K), the thermal conductivity of the whole electromagnetic wave absorbing material is 0.1 to 1 W/(m·K)
Data Source
AI summary
A semiconductor device is provided that has high electromagnetic wave shielding properties while exhibiting good heat dissipation. The semiconductor device includes a semiconductor package bonded onto a circuit board, an electromagnetic wave absorbing layer covering surfaces of the semiconductor package other than a surface bonded to the circuit board, and an electromagnetic wave reflecting layer covering the electromagnetic wave absorbing layer on a side remote from the semiconductor package, in which the electromagnetic wave absorbing layer is made of resin containing magnetic particles or carbon, and the electromagnetic wave reflecting layer is made of resin containing conductive particles.