Semiconductor Shielding via Adhesive-Free Pressure Bonding

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Solution Overview

Problem

Existing semiconductor manufacturing methods face challenges in effectively protecting semiconductor chips from magnetic and electromagnetic noise due to the limitations of adhesive agents used in shield packaging, which reduce magnetic permeability and contaminate manufacturing apparatuses, and complicate laser marking.

Innovation Solution

A semiconductor device design that employs magnetic and conductive shield members connected via pressure bonding processes without adhesive agents, using high permeability materials like iron or permalloy to form a shield structure that protects against magnetic noise and electromagnetic interference, while avoiding the use of shield layers that can contaminate equipment and complicate marking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive agent is used to bond holding plate and lid plate, then the magnetic member can be assembled, but the magnetic permeability is lowered and an additional step is required

Engineering Contradiction:

Improveassembly processVSAvoidmagnetic permeability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention extracts and removes the adhesive agent from the magnetic member assembly. By bonding the holding plate and lid plate directly without adhesive, the magnetic member maintains high magnetic permeability throughout, eliminating the non-magnetic adhesive layer that would otherwise interrupt magnetic flux paths.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the holding plate and lid plate into a unified magnetic member structure through direct bonding. This integration ensures continuous magnetic permeability across the entire assembly, allowing magnetic flux to flow uniformly without encountering non-magnetic adhesive barriers.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If adhesive agent is used to bond holding plate and lid plate, then the magnetic member can be assembled, but an additional bonding step is required

Engineering Contradiction:

Improveassembly processVSAvoidmanufacturing steps

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If shield layer is coated on semiconductor package surface, then electromagnetic shielding is achieved, but manufacturing apparatus contamination occurs

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidapparatus contamination

Core Design Contradiction:

Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

Instead of coating the shield layer on the external surface of the semiconductor package, the invention inverts the approach by placing the conductive shield layer on the internal bottom surface of the package. This internal placement prevents the shield material from contacting and contaminating manufacturing apparatus during assembly processes.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention moves the shield layer from the external surface dimension to the internal bottom surface dimension. This spatial relocation allows the shield to maintain its electromagnetic shielding function while eliminating the contamination issue associated with external coating.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Object-affected harmful factors

If shield layer is coated on semiconductor package surface, then electromagnetic shielding is achieved, but shielding effect is lowered when shield layer comes off

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidshielding effectiveness

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

5Object-affected harmful factors

If shield layer is coated on semiconductor package surface, then electromagnetic shielding is achieved, but laser marking becomes difficult

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidlaser marking

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the shielding effect, reduces material costs and manufacturing burdens, and allows for efficient protection of semiconductor chips from both magnetic and electromagnetic noise without compromising the integrity of the manufacturing process.

Implementation Method 1

a magnetic material having high magnetic permeability is generally arranged near the semiconductor chip so as to let the magnetic field escape through the magnetic material

Methodology Applied

Scientific EffectMagnetic permeability: Magnetic Field

Implementation Method 2

the surface of a semiconductor package is generally coated with a shield layer having high electrical conductivity and the shield layer is connected to a ground layer provided in a substrate so that the electromagnetic wave is reflected on the shield layer and escapes into the ground layer

Methodology Applied

Scientific EffectElectromagnetic reflection: Reflection

Data Source

PatentUS10546819B2Semiconductor device and method of manufacturing the same

Publication Date: 2020.01.28 KIOXIA CORP

AI summary

In one embodiment, a semiconductor device includes a substrate, and a first shield member provided on or in the substrate. The device further includes a semiconductor chip provided on the first shield member, and a first wire electrically connected to the semiconductor chip and the substrate. The device further includes a second wire electrically or magnetically connected to the first shield member, and a second shield member provided above the semiconductor chip, electrically insulated from the first wire, and electrically or magnetically connected to the second wire.