Semiconductor Shielding Structure for Silver Ion Migration Control
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Solution Overview
Problem
The patch silver paste used in semiconductor device packaging can lead to electrochemical migration of silver ions under an electric field, causing increased leakage or short circuits due to migration to the front surface of the semiconductor chip, resulting in device failure.
Innovation Solution
A shielding structure is integrated and electrically connected to a preset potential, creating an electric field or zero electric field that inhibits silver ion migration from the active region to the non-active region, effectively shielding the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If patch silver paste is used to electrically connect metal connection electrodes to metal electrodes in the packaging shell, then connection cost is reduced, but silver ions migrate to the front surface of the semiconductor chip under electric field action, causing increased leakage or short circuit
Solution Approach 1:
A shielding structure is introduced as an intermediary element between the patch silver paste and the active region of the semiconductor chip. This shielding structure, when electrically connected to a preset potential, generates an electric field that acts as a mediator to repel silver ions away from the active region, thereby preventing short circuits while maintaining the use of cost-effective patch silver paste for electrical connections
2Reliability
If shielding structure is added to prevent silver ion migration, then device reliability is improved, but device complexity increases
Solution Approach 1:
The shielding structure is strategically positioned only in specific regions where silver ion migration poses a threat to the active region, rather than implementing a comprehensive shield across the entire device. This localized approach provides targeted protection against ion migration while minimizing the overall structural complexity and material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures stable performance of the semiconductor device by preventing silver ion migration and avoiding short circuits, ensuring normal operation and extending the device's lifespan.
Implementation Method 1
the patch silver paste may lead to electrochemical migration of silver ions under the action of an electric field
Implementation Method 2
by setting a shielding structure and electrically connecting the shielding structure to a preset potential, an electric field or a zero electric field of the active region pointing toward the non-active region can be formed, effectively shielding silver ions
Data Source
AI summary
Embodiments of the present disclosure disclose a semiconductor device and a manufacturing method thereof. The semiconductor device includes an active region and a passive region surrounding the active region. The semiconductor device further includes a substrate, a multi-layer semiconductor layer located on one side of the substrate, and at least one shielding structure located on one side of the substrate, the shielding structure being electrically connected to a preset potential, for forming an electric field or a zero electric field of the active region pointing toward the passive region.