Semiconductor Package Shielding Tape Absorbing Electromagnetic Waves

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Solution Overview

Problem

High-performance semiconductor packages face challenges in effectively shielding electromagnetic waves, which can lead to malfunction in peripheral devices if not properly managed, and existing solutions may generate particles that cause short circuits, increasing production costs and waste.

Innovation Solution

A semiconductor package manufacturing method involving a flexible film with input and output wire patterns, a semiconductor chip with metal bumps connected to these patterns, and absorber and shielding tapes with absorption films and protective insulating films, including metal alloys like iron and nickel, and insulating materials like polyethylene terephthalate, to absorb and shield electromagnetic waves, while minimizing particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If absorber and shielding tape is attached to shield electromagnetic waves, then electromagnetic wave shielding is improved, but particles may be generated that cause short circuits

Engineering Contradiction:

Improveelectromagnetic wave shieldingVSAvoidparticle generation

Core Design Contradiction:

Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

A release film is introduced as an intermediary between the absorber/shielding tape and the semiconductor chip. The release film prevents direct contact between the tape material and the chip, thereby preventing particle generation that could cause short circuits, while still allowing the tape to effectively shield electromagnetic waves.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The release film is a disposable protective layer that is present during manufacturing and assembly, then removed or left as a permanent protective barrier. This simple, inexpensive component effectively prevents particle contamination without interfering with the electromagnetic shielding function.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Object-affected harmful factors

If absorber and shielding tape is attached to shield electromagnetic waves, then electromagnetic wave shielding is improved, but production costs increase

Engineering Contradiction:

Improveelectromagnetic wave shieldingVSAvoidproduction cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The absorber and shielding functions are combined into a single integrated tape structure with multiple layers (absorber layer, shielding layer, release film). This consolidation reduces the number of separate components and assembly steps, thereby reducing production costs while maintaining effective electromagnetic wave shielding.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The tape uses composite material structure combining different functional layers (absorber material, shielding material, release film material). This composite approach allows each layer to perform its specific function efficiently, reducing the need for multiple separate components and lowering overall production costs.

Inventive Principle:

Principle #40Composite materials

3Object-affected harmful factors

If multiple layers are used in absorber and shielding tape, then shielding effectiveness is improved, but device complexity increases

Engineering Contradiction:

Improveshielding effectivenessVSAvoidstructure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shielding tape is segmented into distinct functional layers (absorber layer, shielding layer, release film), where each layer performs a specific function. This segmentation allows for optimized performance of each function while maintaining a manageable overall structure that can be manufactured and assembled efficiently.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances electromagnetic wave shielding, reduces particle-related defects, and minimizes production costs by effectively managing electromagnetic interference and heat dissipation, thereby improving the reliability and efficiency of semiconductor packages.

Implementation Method 1

a first absorber and shielding tape and a second absorber and shielding tape, each comprising an absorption film and a protective insulating film formed on the absorption film

Methodology Applied

Scientific EffectElectromagnetic wave absorption: Absorption (EM radiation)

Implementation Method 2

The absorption film may include a metal alloy including either one or both of iron (Fe) and nickel (Ni), or an Mn—Zn alloy

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10741521B2Semiconductor package and method of manufacturing semiconductor package

Publication Date: 2020.08.11 MAGNACHIP SEMICON LTD

AI summary

A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.