Semiconductor Device Shielding Layer Via Grounding
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Solution Overview
Problem
Existing semiconductor devices face challenges in downsizing while effectively shielding electromagnetic noise, which interferes with other circuits and radio wave reception, especially in mobile communication equipment.
Innovation Solution
A semiconductor device design incorporating a circuit substrate with an insulating layer, interconnection layers, vias, a sealing resin layer, and a conductive shielding layer, where the shielding layer is connected to the vias and exposed at the side surface to provide multiple ground potential contacts, enhancing electromagnetic noise shielding without increasing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield plate covering a circuit module is provided to shield electromagnetic noise, then electromagnetic noise shielding is improved, but the circuit module size increases
Solution Approach 1:
The conductive shielding layer is formed within the existing circuit module structure, nested between the insulating layer and the sealing resin layer. This integration allows the shielding function to be embedded without adding external components, thus achieving electromagnetic noise shielding without increasing the overall module size
Solution Approach 2:
The shielding function is merged with the existing circuit module layers by forming the conductive shielding layer as part of the module's internal structure. The shielding layer is combined with the insulating layer, semiconductor element, and sealing resin layer into a unified integrated structure, eliminating the need for separate shield plates
2Area of stationary object
If a shield film is formed on the outer periphery of a semiconductor element to enable downsizing, then circuit module size is reduced, but electromagnetic noise shielding effectiveness decreases
Solution Approach 1:
The shielding approach transitions from a two-dimensional surface film on the outer periphery to a three-dimensional integrated structure where the conductive shielding layer is positioned within the module's internal layers. This dimensional change allows the shielding layer to be strategically positioned at critical locations where electromagnetic noise generation and propagation occur, achieving effective shielding in a compact form
Solution Approach 2:
Instead of uniformly applying a shield film across the entire outer periphery, the conductive shielding layer is selectively positioned within the module structure where it is most needed for noise shielding. The shielding function is concentrated at critical locations, providing localized quality enhancement where electromagnetic noise protection is most effective while maintaining compact dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields electromagnetic noise across a wide frequency range, improving noise reduction by up to 15 dB compared to traditional shielding methods, while allowing for smaller circuit module sizes and higher speed operations.
Implementation Method 1
a conductive shielding layer 40 covering the sealing resin layer 30 and part of an end portion of the circuit substrate 10
Data Source
AI summary
According to one embodiment, a semiconductor device includes a circuit substrate, a semiconductor element, a sealing resin layer, and a conductive shielding layer. The circuit substrate includes an insulating layer, a plurality of interconnections forming first interconnection layers provided on an upper surface side of the insulating layer, a plurality of interconnections forming second interconnection layers provided on a lower surface side of the insulating layer, and a plurality of vias penetrating from the upper surface to the lower surface of the insulating layer. The semiconductor element is mounted on the upper surface side of the circuit substrate. The conductive shielding layer covers the sealing resin layer and part of an end portion of the circuit substrate. Any of the plurality of vias and the conductive shielding layer are electrically connected.