Semiconductor Shielding Wall Protrusions for EMI Reduction
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Solution Overview
Problem
The increasing complexity and miniaturization of semiconductor devices lead to higher electromagnetic interference (EMI) due to increased electromagnetic emissions, which can adversely affect neighboring devices, and existing shielding solutions like compartment shielding made of silver or copper are costly.
Innovation Solution
A semiconductor package device incorporating a substrate with a conductive shielding wall and package body, featuring protruding portions and through holes, which reduces material usage while maintaining effective EMI shielding performance by reflecting electromagnetic waves multiple times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If compartment shielding made of silver or copper is used, then EMI shielding performance is improved, but manufacturing cost increases
Solution Approach 1:
The shielding wall is divided into multiple protruding portions that extend from the conductive main body. These segmented structures create multiple reflection surfaces for electromagnetic waves, improving shielding performance while using less material than a solid compartment shield, thereby reducing manufacturing cost.
Solution Approach 2:
The shielding structure transitions from a traditional planar compartment shield to a three-dimensional structure with protruding portions extending in multiple directions. This dimensional change creates additional electromagnetic wave reflection paths and surfaces, enhancing shielding effectiveness without proportionally increasing material usage or cost.
2Volume of moving object
If semiconductor devices are miniaturized and densely packed, then device size is reduced, but EMI increases due to higher density of devices
Solution Approach 1:
The shielding wall is positioned locally between adjacent semiconductor devices to provide targeted EMI protection only where needed. The protruding portions are strategically arranged to shield specific areas, allowing miniaturization and dense packing while maintaining localized shielding effectiveness without requiring comprehensive shielding throughout the entire device.
3Object-affected harmful factors
If traditional compartment shielding is used, then EMI shielding is achieved, but material usage increases
Solution Approach 1:
Instead of using a solid compartment shield that requires extensive material, the invention segments the shielding into a conductive main body with multiple protruding portions. This segmentation maintains shielding functionality through strategic placement of conductive elements, significantly reducing the total volume of shielding material required.
Solution Approach 2:
The protruding portions extend partially into the space between devices to provide sufficient shielding coverage. The extensions are designed to be just long enough to effectively block and reflect electromagnetic waves, avoiding excessive material usage while maintaining adequate shielding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI without significantly increasing manufacturing costs, achieving shielding performance comparable to traditional methods while minimizing material usage.
Implementation Method 1
reduces material usage while maintaining effective EMI shielding performance by reflecting electromagnetic waves multiple times
Data Source
AI summary
The present disclosure provides for a semiconductor package device and a method for manufacturing the same. The semiconductor package device includes a substrate, a shielding wall and a package body. The substrate has a top surface. The shielding wall is disposed on the top surface. The shielding wall has a conductive main body and a plurality of protruding portions extending from the conductive main body. The package body encapsulates the shielding wall.