Semiconductor Package Shunt Trace Layout Without Wire Bonds

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Solution Overview

Problem

Conventional semiconductor packages face issues with reliability due to imperfections in leadframe substrates and the use of wire bonds and solder connections, which can lead to functional or cosmetic defects and residual stresses.

Innovation Solution

The semiconductor package design includes a base layer with electrical contact pads, an embedded semiconductor die, a shunt, and metal pillars, with a metal trace patterned over the shunt and die to electrically connect them to the contact pads via the pillars, reducing or eliminating wire bond and solder connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonds and solder connections are used to connect the shunt to electrical contact pads, then electrical connectivity is achieved, but reliability deteriorates due to defects and residual stresses

Engineering Contradiction:

Improvepackage reliabilityVSAvoidconnection structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the shunt and amplifier into a single integrated component, eliminating the need for separate wire bonds and solder connections between these elements. The metal trace pattern provides direct electrical connection between the shunt and contact pads, combining multiple functions into a unified structure that improves reliability by removing potential failure points from traditional interconnection methods

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention extracts and eliminates the wire bond and solder connection elements from the package structure. By removing these traditional interconnection components and replacing them with a metal trace pattern on the substrate, the patent eliminates the sources of defects and residual stresses associated with wire bonding and soldering processes

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If a stamped leadframe is used as the substrate, then structural support is provided, but reliability worsens due to imperfections in the leadframe substrate

Engineering Contradiction:

Improvepackage reliabilityVSAvoidsubstrate quality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the fundamental parameters of the substrate by transitioning from a stamped leadframe construction to a layered substrate structure with metal traces. This parameter change allows for better control of electrical properties and mechanical integrity, eliminating the imperfections inherent in stamped metal substrates while providing the necessary structural support

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention employs a composite substrate structure consisting of multiple layers including dielectric materials and metal trace layers. This composite construction combines the advantages of different materials to provide both structural support and electrical connectivity with higher precision and fewer defects compared to traditional stamped leadframe substrates

Inventive Principle:

Principle #40Composite materials

3Reliability

If metal pillars and patterned metal traces are used instead of wire bonds, then reliability improves by eliminating connection defects, but manufacturing complexity increases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing process simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical wire bonding process with a metallization process that deposits and patterns metal traces directly on the substrate. This substitution eliminates the mechanical stress and potential defects associated with wire bonding while providing reliable electrical connections through a more integrated manufacturing process

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The metal traces and pillars are formed as part of the substrate fabrication process before the final assembly steps. By preliminarily creating the electrical connection structures during substrate manufacturing, the patent eliminates the need for separate wire bonding operations, thereby improving reliability while streamlining the overall manufacturing process

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12211800B2Semiconductor package with shunt and patterned metal trace

Publication Date: 2025.01.28 TEXAS INSTRUMENTS INC

AI summary

A semiconductor package includes a first layer including a semiconductor die and a shunt embedded within a first dielectric substrate layer, and metal pillars extending therethrough. The semiconductor package further includes a second layer stacked on the first layer, the second layer including a metal trace patterned on the first dielectric substrate layer, and a second dielectric substrate layer over the metal trace. The metal trace electrically connects a first portion of the shunt to a first metal pillar of the metal pillars and electrically connects a second portion of the shunt to a second metal pillar of the metal pillars. The semiconductor package further includes a base layer opposite the second layer relative the first layer, the base layer forming exposed electrical contact pads for the semiconductor package, the electrical contact pads providing electrical connections to the shunt, the metal pillars, and the semiconductor die.