Semiconductor Device Side Surface Electrode Visual Inspection
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Solution Overview
Problem
Conventional semiconductor devices require X-ray inspection to confirm solder bonding state due to the absence of wiring layers on side surfaces after dicing, making visual confirmation difficult.
Innovation Solution
A semiconductor device design with a substrate, wiring layer, semiconductor element, and sealing resin, where the side surface electrode is exposed and flush with the resin side surface, allowing for visual confirmation of solder bonding, and a manufacturing method involving groove formation, wiring layer deposition, semiconductor mounting, and resin cutting to create exposed electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dicing is performed after forming the wiring layer on the Si wafer, then the semiconductor elements are divided into individual pieces, but the wiring layer is not formed on the side surface of the Si substrate, making visual confirmation of solder bonding difficult
Solution Approach 1:
The wiring layer is formed on the Si wafer before dicing, ensuring that the wiring structure is established in advance. This preliminary formation allows the wiring layer to extend onto the side surfaces after dicing, enabling visual inspection of solder bonding without requiring additional post-dicing processing steps.
2Ease of manufacture
If the wiring layer is formed only on the top surface of the Si substrate, then the manufacturing process is simple, but the solder bonding state cannot be visually confirmed
Solution Approach 1:
The wiring layer is extended from the top surface onto the side surfaces of the Si substrate. This dimensional extension allows the wiring layer to serve dual purposes: maintaining simple top-surface formation processes while simultaneously enabling visual inspection of solder bonding from the side, thus resolving the contradiction between manufacturing simplicity and inspection ease.
3Reliability
If the side surface electrode is not exposed from the sealing resin, then the sealing is complete and protected, but the solder bonding state remains invisible
Solution Approach 1:
The side surface electrode is selectively exposed from the sealing resin at specific locations while maintaining sealing protection in other areas. This local exposure allows visual confirmation of solder bonding at the electrode interface without compromising the overall sealing protection of the semiconductor element, resolving the contradiction between sealing reliability and bonding detectability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and visual confirmation of solder bonding during mounting on a circuit board, enhances solder bonding strength with external plating, and prevents chipping during silicon substrate processing.
Implementation Method 1
a wiring layer (20) formed on the Si substrate (10)
Implementation Method 2
when the semiconductor device is mounted on a circuit board of an electronic device or the like using solder
Data Source
AI summary
Semiconductor device includes: substrate having substrate main surface and substrate rear surface facing opposite sides to each other in first direction, and substrate side surface facing in second direction orthogonal to the first direction; wiring layer having main surface electrode covering a portion of the substrate main surface, and side surface electrode connected to the main surface electrode and covering a portion of the substrate side surface; semiconductor element electrically connected to the main surface electrode and mounted on the substrate to face the substrate main surface; and sealing resin having resin side surface facing in the same direction as the substrate side surface, and covering the semiconductor element and the main surface electrode, wherein the side surface electrode has side exposed surface exposed from the sealing resin and facing in the same direction as the substrate side surface, the side exposed surface being flush with the resin side surface.