Semiconductor Package Side Wall Coating for Particle Contamination Control
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Solution Overview
Problem
During the batch packaging of semiconductor devices, undesired particles are released from cut surfaces during dicing processes, leading to contamination and thermal impacts, which existing methods fail to adequately address.
Innovation Solution
A semiconductor package with side walls coated using materials like acryl, silicone, or epoxy-based coating materials with less than 10% filler particles, which are applied to seal and protect cut surfaces, reducing particle emission and environmental impact, and are designed to maintain minimal width and uniformity for effective sealing and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing processes are used to cut semiconductor packages, then productivity is improved through batch processing, but particle contamination and thermal impact worsen due to particles released from cut surfaces
Solution Approach 1:
The patent applies preliminary action by performing a pre-cutting process before the final laser cutting step. The pre-cutting creates initial separation grooves that reduce the material thickness for the subsequent laser cutting, thereby minimizing particle generation during the final cut while maintaining batch processing efficiency.
Solution Approach 2:
The patent introduces an intermediary cleaning and drying process between the pre-cutting and final laser cutting steps. This intermediary step removes particles and sludge generated during pre-cutting before the final cutting operation, preventing contamination while allowing batch processing to continue.
2Manufacturing precision
If laser beam cutting is used to cut remaining thickness, then manufacturing precision is improved, but thermal impact worsens on the semiconductor substrate
Solution Approach 1:
The patent applies preliminary action by performing pre-cutting to remove the majority of material thickness before applying the laser beam. This reduces the remaining thickness that requires high-precision laser cutting, thereby maintaining manufacturing precision while significantly reducing the thermal energy required and the resulting thermal impact on the semiconductor substrate.
3Productivity
If conventional dicing processes are used, then productivity is improved, but particle emission worsens from cut surfaces
Solution Approach 1:
The patent converts the harmful particle emission into a beneficial process by using the pre-cutting step to generate controlled particles and sludge that are then systematically removed by the cleaning and drying process. This transforms the harmful byproduct into a manageable intermediate state that enables the final precision cut with minimal particle emission.
Solution Approach 2:
The patent applies preliminary action by performing pre-cutting with a dicing wheel to create initial grooves and remove bulk material before the final laser cutting. This preliminary mechanical cutting, followed by cleaning, reduces the material remaining for laser cutting and minimizes particle generation during the final high-precision step while maintaining batch processing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating solution effectively seals cut surfaces, reducing particle emission and environmental impact, while ensuring the semiconductor package's sensitivity and functionality are preserved, allowing for efficient batch processing and minimizing mechanical and chemical stress on sensitive elements.
Implementation Method 1
the coating material has a good adhesion to the cut surface
Data Source
Figure 1a~1c
Figure 2a~2c
Figure 2d~2e
AI summary
A semiconductor package comprises an integrated device, a front side (1) of a material A and a back side (2) of a material B opposite to the front side (1). Side walls (3) link the front side (1) and the back side (2). Each side wall (3) is coated with a coating material (4) to at least 80 % of its area, wherein the coating material (4) is different from the material A and different from the material B.