Semiconductor Element Sidewall Structure for Bonding Layer Isolation
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Solution Overview
Problem
In semiconductor devices, the difference in power supply voltages between the control and drive elements leads to a risk of electric breakdown due to the insulating element's bonding layer rising and potentially causing short circuits with conductive wires, especially when the bonding layer adheres to the wire conductively bonded to the insulating element.
Innovation Solution
The semiconductor element features a main body with distinct side surfaces and surface roughness configurations that prevent the bonding layer from rising excessively, ensuring it does not adhere to wires, and includes a dielectric layer between inductors or capacitors for insulation, thereby preventing short circuits and enhancing dielectric strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating element is bonded to a die pad using a bonding layer made of paste containing metal particles, then electrical insulation between control element and drive element is achieved, but the bonding layer may rise onto the insulating element and cause short circuit between die pad and wire
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the bonding layer and the insulating element. This resin layer acts as a barrier that prevents the bonding layer material from rising onto the insulating element while still allowing the bonding layer to perform its electrical insulation function. The resin layer mediates between the bonding requirements and the prevention of material migration.
Solution Approach 2:
The harmful rising behavior of the bonding layer is prevented by extracting or removing the possibility of material migration through the addition of the resin layer. The resin layer effectively separates the bonding function from the potential harmful effect of material rising onto the insulating element.
2Ease of manufacture
If the bonding layer is made fluid during bonding process, then proper bonding between insulating element and die pad is achieved, but the fluid bonding layer may excessively rise onto the insulating element and adhere to conductive wires
Solution Approach 1:
The resin layer serves as a mediator that allows the bonding layer to remain fluid during the bonding process for ease of manufacture, while simultaneously preventing the fluid bonding layer from excessively rising onto the insulating element. The resin layer confines the bonding layer material in its intended position.
Solution Approach 2:
The resin layer is applied in advance to prevent the bonding layer from rising onto the insulating element before the bonding process occurs. This preliminary protective measure counteracts the potential harmful effect of material rising while maintaining the benefits of fluid bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively suppresses the rising of the bonding layer, preventing short circuits and improving the dielectric strength of the semiconductor device, ensuring reliable signal transmission and operation under varying voltage conditions.
Implementation Method 1
a transmitting-side inductor and a receiving-side inductor that are inductively coupled to each other
Implementation Method 2
an insulating element is interposed in the electric signal transmission path between the control element and the drive element to insulate the control element and its conductive path and the drive element and its conductive path from each other
Data Source
AI summary
A semiconductor element includes a main body having an obverse surface and a reverse surface facing away from each other in a first direction and a plurality of electrodes disposed on the obverse surface and electrically conducting to the main body. The main body has a first side surface facing in the second direction x. The first side surface includes a first edge that is farthest from the reverse surface. The main body has a second side surface connected to the first edge and located between the first side surface and the obverse surface in the first direction z. The second side surface overlaps with the reverse surface as viewed in the first direction z. The surface roughness of the first side surface differs from that of the second side surface.