Semiconductor Simulation System for Silicon Loss Analysis
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Solution Overview
Problem
The semiconductor industry faces challenges in accurately simulating the complex electrical characteristics of highly integrated and miniaturized semiconductor devices, leading to unintended electrical characteristics and increased costs due to the need for extensive experimentation to understand and optimize semiconductor processes.
Innovation Solution
A simulation system utilizing a finite difference method (FDM) to calculate heat energy and a finite-element method (FEM) to calculate temperature and phase changes, which enables the calculation of silicon loss and analysis of voids and defect probabilities in a semiconductor device, thereby improving product reliability and reducing experimental costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If extensive experimentation is conducted to understand and optimize semiconductor processes, then manufacturing precision is improved, but loss of time and productivity deteriorate
Solution Approach 1:
The patent applies preliminary action by performing process-device simulations before actual semiconductor manufacturing. The simulation system predicts electrical characteristics and optimizes process parameters in advance, allowing manufacturers to prepare optimal processing conditions without conducting extensive physical experiments. This preliminary computational analysis reduces the need for iterative trial-and-error experimentation, thereby improving productivity while maintaining manufacturing precision.
2Reliability
If extensive experimentation is conducted to understand semiconductor processes, then reliability is improved, but loss of time and productivity deteriorate
Solution Approach 1:
The simulation system performs preliminary analysis of electrical characteristics and device performance before manufacturing. By predicting reliability issues and optimizing process parameters computationally, the system ensures high reliability outcomes without requiring extensive physical experimentation, thus maintaining productivity.
3Manufacturing precision
If extensive experimentation is conducted to understand semiconductor processes, then manufacturing precision is improved, but loss of energy increases
Solution Approach 1:
The patent replaces physical experimentation with computational simulation. Instead of conducting energy-intensive physical experiments to optimize semiconductor processes, the system uses computer-based simulations to predict outcomes and optimize parameters. This substitution of mechanical/physical experimentation with computational analysis significantly reduces energy consumption while maintaining manufacturing precision.
4Reliability
If extensive experimentation is conducted to understand semiconductor processes, then reliability is improved, but loss of energy increases
Solution Approach 1:
The simulation system replaces energy-intensive physical experimentation with computational analysis. By predicting device reliability and optimizing processes through simulation rather than physical testing, the system ensures high reliability outcomes with minimal energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simulation system effectively simulates heat energy, temperature, and phase changes, allowing for the accurate estimation of silicon loss and defect probabilities, enhancing semiconductor device performance and reducing the need for costly experimental processes.
Implementation Method 1
calculate heat energy data generated by light energy provided to a simulation domain
Implementation Method 2
use a finite-element method (FEM) to calculate temperature change data of the simulation domain over time
Implementation Method 3
calculate phase change data of the simulation domain over time
Data Source
AI summary
A simulation system is provided. The simulation system comprises a processor, and a storage to store a simulation program that, when executed by the processor, causes the processor to, use a finite difference method (FDM) to calculate heat energy data generated by light energy provided to a simulation domain, receive the calculated heat energy data and use a finite-element method (FEM) to calculate temperature change data of the simulation domain over time and calculate phase change data of the simulation domain over time, and calculate a silicon loss of the simulation domain using the calculated temperature change data and the calculated phase change.


