Semiconductor Silylation Liquid for ALD Deposition Suppression
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Solution Overview
Problem
Existing methods for forming semiconductor elements, such as photolithography and selective deposition using atomic layer deposition (ALD), face challenges in achieving precise alignment and material deposition control, particularly when forming coating films that inhibit material deposition.
Innovation Solution
A chemical liquid comprising a silylation agent, an aprotic solvent, and an alcohol, with specific alcohol content and composition, is used to form a coating film that suppresses material deposition during ALD treatment, allowing for precise control of material distribution on substrates with different materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a coating film is formed using a chemical liquid containing a silicon compound, then a protective film is formed on the substrate, but a large amount of material is deposited on the coating film during ALD treatment
Solution Approach 1:
The patent changes the chemical composition parameters of the coating liquid by introducing a specific alcohol component (5-200 ppm) and controlling water content (100 ppm or less), which modifies the coating film's properties to suppress material deposition during ALD treatment
Solution Approach 2:
The patent creates a composite coating liquid system combining silylation agents, aprotic solvents, and specific alcohols in controlled proportions, where the alcohol component (5-200 ppm) works synergistically with other components to achieve suppressed material deposition
2Manufacturing precision
If photolithography is used for pattern formation, then semiconductor elements can be formed, but alignment accuracy deteriorates with further miniaturization
Solution Approach 1:
The patent replaces photolithography (optical system) with a chemical-based selective deposition method using ALD, where coating films formed by chemical liquids control material deposition through chemical rather than optical means, enabling better alignment accuracy at smaller scales
3Manufacturing precision
If selective adsorption method is used to form coating films, then material deposition can be controlled, but coating film formation uniformity becomes difficult to maintain
Solution Approach 1:
The patent optimizes chemical parameters including alcohol content (5-200 ppm), water content (100 ppm or less), and silylation agent concentration to achieve uniform coating film formation while maintaining suppressed material deposition properties
Solution Approach 2:
The patent creates a coating liquid with specific local properties (controlled alcohol and water content) that enable selective coating film formation on specific substrate regions while maintaining uniformity across the entire coating surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chemical liquid effectively forms a hydrophobic coating film that reduces material deposition during ALD, enabling precise material placement and improved accuracy in semiconductor manufacturing.
Implementation Method 1
a silylation agent; an aprotic solvent; and an alcohol, in which a content of the alcohol is 5 to 200 ppm by mass with respect to a total mass of the chemical liquid
Implementation Method 2
The chemical liquid effectively forms a hydrophobic coating film that reduces material deposition during ALD
Implementation Method 3
utilizing selective adsorption of a compound to a region formed of a specific material, a film consisting of such a compound is selectively formed
Data Source
AI summary
Provided is a chemical liquid capable of forming a coating film in which the deposition of a material by an ALD treatment is suppressed. The chemical liquid according to the present invention is a chemical liquid used for manufacturing a semiconductor, including a silylation agent, an aprotic solvent, and an alcohol, in which a content of the alcohol is 5 to 200 ppm by mass with respect to a total mass of the chemical liquid.