Semiconductor Simulation Correlating Shape and Logic Data
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Solution Overview
Problem
Current simulations of semiconductor devices using fixed excitation sources and power sources fail to accurately replicate the physical characteristics, such as heat generation and electromagnetic interference, encountered during actual operation, leading to inaccurate examinations.
Innovation Solution
A non-transitory computer-readable recording medium and computing device that executes simulations by correlating part shape, logical model, and functional block information to simulate semiconductor devices, allowing for accurate examination of heat and noise distribution by designating positional information of functional blocks, thereby mimicking operational conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If fixed excitation source and power source are used in simulation, then simulation setup is simple, but physical characteristics differ from actual operation
Solution Approach 1:
The patent applies dynamics by transitioning from fixed, static excitation sources to dynamic excitation sources that can be positioned and configured according to actual operational conditions. The simulation system now allows dynamic setting of excitation source positions, power source positions, and operational parameters to match real-world semiconductor device operation, thereby improving physical characteristics accuracy while maintaining reasonable setup complexity through automated positioning algorithms.
Solution Approach 2:
The patent implements parameter changes by allowing variable configuration of excitation source positions, power source positions, and operational parameters in the simulation. Instead of fixed parameters, the system accepts multiple parameter sets representing different operational conditions, enabling accurate replication of actual device behavior under various working conditions while managing complexity through systematic parameter management.
2Measurement precision
If multiple types of information are integrated for simulation, then examination accuracy improves, but data processing complexity increases
Solution Approach 1:
The patent applies merging by integrating multiple types of information (circuit design information, layout information, electrical characteristic information, and operational condition information) into a unified simulation framework. This combination enables comprehensive examination of semiconductor devices under actual operational conditions, improving examination accuracy while the systematic integration approach manages the complexity of processing diverse data types.
Solution Approach 2:
The patent implements universality by creating a multi-functional simulation system that can process various types of information (circuit, layout, electrical characteristics, operational conditions) and perform multiple examination functions (heat generation, electromagnetic interference, signal integrity) within a single integrated platform, thereby improving examination accuracy without proportionally increasing processing complexity.
Data Source
AI summary
A non-transitory computer readable recording medium includes simulation data input into a computing device executing a simulation of a semiconductor device, wherein the simulation data includes part shape information describing shape and terminal information of the semiconductor device, logical model information describing operation and connection information of an element in the semiconductor device, and functional block information describing positional information of a functional block in the semiconductor device, and the computing device causes the part shape information, the logical model information, and the functional block information to correspond to each other to execute the simulation of the semiconductor device.