Semiconductor Assembly Singulation Using Frangible Encapsulant Links
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Solution Overview
Problem
The existing methods for manufacturing semiconductor assemblies face difficulties in forming encapsulants around individual semiconductor dies, leading to wear on cutting tools and handling challenges due to the encapsulant detaching from the leadframe upon cutting.
Innovation Solution
The method involves forming semiconductor assemblies with frangible connections between adjacent assemblies, allowing for easier handling by applying force to break these connections, which are created by cutting the encapsulant, and can be performed from above or below the assemblies, with the encapsulant having inwardly tapering upper sides and a curved or chamfered lower surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single encapsulant covering a row of semiconductor dies is cut to form individual encapsulants, then the formation of encapsulants becomes easier, but the cutting tool suffers considerable wear
Solution Approach 1:
The encapsulant is divided into frangible connections between adjacent semiconductor assemblies, allowing the encapsulant to be formed as a continuous structure that can be easily manufactured while enabling clean separation without excessive tool wear
2Productivity
If the encapsulant is cut to form individual semiconductor assemblies, then the assemblies can be separated, but the semiconductor assemblies fall away from the leadframe making handling difficult
Solution Approach 1:
The frangible connections are pre-formed in the encapsulant structure before separation is needed. These pre-formed weak points allow controlled breaking of connections while maintaining assembly integrity during handling, solving both separation and handling difficulties
Data Source
AI summary
A method of manufacturing semiconductor assemblies is provided, the method includes forming an array of semiconductor assemblies, the semiconductor assemblies including encapsulant having frangible connections between adjacent semiconductor assemblies; and applying force to the semiconductor assemblies to break the frangible connections and thereby singulate the semiconductor assemblies.