Semiconductor Assembly Singulation With Frangible Encapsulant Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing semiconductor assemblies face challenges in forming encapsulants, as they often result in significant wear on cutting tools and make it difficult to handle individual semiconductor assemblies after cutting, due to the encapsulant falling away from the leadframe.
Innovation Solution
The method involves forming semiconductor assemblies with frangible connections between adjacent assemblies, allowing for easier handling by applying force to break these connections, which can be created by cutting the encapsulant from above or below, and using a mould to form the encapsulant with specific edge configurations such as inwardly tapering upper sides and curved or chamfered lower surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single encapsulant covering a row of semiconductor dies is cut to form individual encapsulants, then the formation of the encapsulant is easier, but the saw used to cut the encapsulant suffers considerable wear and the semiconductor assembly falls away from the leadframe making it difficult to handle
Solution Approach 1:
The encapsulant is pre-formed to include frangible connections that allow for easy separation. The cutting operation is performed in advance to create these frangible connections, but the actual separation is deferred until after the semiconductor assemblies have been attached to the leadframe and are more securely positioned.
Solution Approach 2:
The encapsulant is designed with frangible connections that segment the structure into separable portions. These frangible connections are pre-formed thin sections that allow the encapsulant to be divided into individual segments without requiring forceful cutting operations that would cause wear or damage.
2Ease of manufacture
If a single encapsulant covering a row of semiconductor dies is cut to form individual encapsulants, then the formation of the encapsulant is easier, but the saw used to cut the encapsulant suffers considerable wear
Solution Approach 1:
The cutting operation is performed in advance to create frangible connections, but these are thin pre-formed sections rather than complete cuts. This preliminary cutting creates weak points that will separate easily later, avoiding the need for repeated heavy cutting operations that would wear down the saw blade.
Solution Approach 2:
The frangible connections are designed as disposable, sacrificial elements that are easily broken. Rather than using a durable saw blade for the final separation, the design accepts that a simple cutting operation will create frangible tabs that can be broken without requiring a long-lived cutting tool.
3Productivity
If the encapsulant is cut to form individual semiconductor assemblies, then the assemblies can be separated, but the semiconductor assembly falls away from the leadframe making it difficult to handle
Solution Approach 1:
The semiconductor assemblies are first attached to the leadframe in an array configuration, establishing secure connections before the encapsulant is separated. This preliminary attachment ensures that when the encapsulant is divided, the assemblies remain supported and positioned correctly.
Solution Approach 2:
The encapsulant is segmented into frangible connections that can be easily broken while leaving the semiconductor assemblies attached to the leadframe. This segmentation allows the encapsulant to be divided without detaching the assemblies from their support structure.
Data Source
Figure 1~3
Figure 4~6
Figure 7~8
AI summary
A method of manufacturing semiconductor assemblies, the method comprising forming an array of semiconductor assemblies, the semiconductor assemblies including encapsulant having frangible connections between adjacent semiconductor assemblies; and applying force to the semiconductor assemblies to break the frangible connections and thereby singulate the semiconductor assemblies.