Semiconductor Device Lead Frame Sinking Portions
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Solution Overview
Problem
Conventional semiconductor devices require joining materials like Ag paste or solder to fix chip parts to lead frames, which involve high-temperature processes and long processing times, and cannot effectively fix two electrodes of a chip part to adjacent leads without using joining materials.
Innovation Solution
A semiconductor device design that incorporates a lead frame with adjacent leads featuring sinking portions that sandwich and press the chip's electrodes, eliminating the need for joining materials by creating a containing state where the chip is held securely between the leads without the use of conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If joining material (Ag paste or solder) is used to fix chip part to lead frame, then the chip part is securely fixed, but high-temperature processing and long processing time are required
Solution Approach 1:
The invention extracts and eliminates the joining material (Ag paste or solder) from the fixing process. Instead of using external joining materials that require high-temperature processing, the lead frame structure itself is modified to include sinking portions that mechanically engage with and secure the chip part directly, thereby removing the need for separate joining material application and curing processes
Solution Approach 2:
The invention merges the fixing function with the lead frame structure by integrating sinking portions into the lead frame. The sinking portions are formed as integral parts of the lead frame that directly contact and secure the chip part's electrode, combining the support and fixing functions into a single integrated structure without requiring separate joining materials
2Reliability
If joining material is used to fix chip part, then electrical conductivity is achieved, but complex high-temperature processing steps are required
Solution Approach 1:
The invention removes the joining material layer that provides electrical conductivity and replaces it with direct metal-to-metal contact between the lead frame's sinking portions and the chip part's electrode. This eliminates the need for separate conducting materials and their associated application and curing processes
Solution Approach 2:
The invention replaces the chemical/thermal joining process with a mechanical fixing system. The sinking portions are designed to mechanically engage with the chip part's electrode through press-fit or snap-fit mechanisms, substituting the chemical bonding and thermal processing of joining materials with a purely mechanical connection that inherently provides both mechanical strength and electrical conductivity
3Strength
If conventional fixing method with four fixing pins is used, then chip part is secured, but two electrodes cannot be fixed to two adjacent leads
Solution Approach 1:
The invention segments the fixing function into multiple independent sinking portions, each corresponding to a specific electrode position. Instead of using a unified four-pin fixing structure, the lead frame is divided into multiple sinking portions that can independently engage with different electrode configurations, allowing flexible adaptation to various electrode arrangements including two adjacent leads
Solution Approach 2:
The sinking portions are designed with universal functionality to accommodate different electrode configurations. The same sinking portion structure can engage with various electrode types and arrangements (single electrode, dual adjacent electrodes, multiple electrodes in different patterns), making the lead frame adaptable to different chip part designs without requiring configuration-specific fixing structures
Data Source
AI summary
A first lead and a second lead are adjacent. The first lead has a first sinking portion. The second lead has a second sinking portion. The first sinking portion and the second sinking portion are opposed so that the first sinking portion and the second sinking portion sandwich a space. The first sinking portion and the second sinking portion are configured so that the first sinking portion presses a first electrode, and the second sinking portion presses a second electrode in a containing state.