Semiconductor Bonding Structure for Uniform Sintering Load
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices, unevenness in the load applied during the sintering process can lead to breakage of semiconductor elements due to inconsistencies in the thickness of sintering metallic materials and substrate bends, causing uneven pressure distribution.
Innovation Solution
A semiconductor device configuration that includes a first semiconductor element with a first electrode, a first connecting member, and a first member with lower Vickers hardness than the connecting member, which overlaps with the electrode and provides electrical conductivity to equalize the load during sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single pressing member presses each of the connecting members, then the sintering process can be simplified, but the load applied on each of the semiconductor elements becomes uneven due to height inconsistencies
Solution Approach 1:
A pressing plate is introduced as an intermediary component between the pressing member and the connecting members. The pressing plate distributes the pressing force uniformly across all connecting members, ensuring that each semiconductor element receives equal load during sintering, thereby preventing breakage while maintaining a simple pressing mechanism structure
Solution Approach 2:
The pressing plate is designed with specific physical parameters (larger surface area, appropriate thickness, and material properties) that enable it to evenly distribute the pressing force. By changing the geometric and material parameters of the pressing plate, the system achieves uniform load distribution without complicating the overall pressing mechanism
2Ease of manufacture
If the sintering metallic material thickness is inconsistent, then the bonding process becomes simpler, but the position unevenness of connecting members increases
Solution Approach 1:
The pressing plate serves as a mediator that compensates for thickness variations in the sintering metallic material. By providing a rigid, flat surface that distributes pressure evenly, the pressing plate ensures that connecting members are pressed to a uniform height regardless of underlying material thickness variations
Solution Approach 2:
The pressing plate is designed beforehand to accommodate and compensate for expected variations in sintering metallic material thickness. Its structural design anticipates and counteracts potential position unevenness before it affects the final assembly quality
3Ease of operation
If the substrate has a bend, then the mounting process becomes easier, but the load distribution on semiconductor elements becomes uneven
Solution Approach 1:
The pressing plate acts as an intermediary that bridges the gap between the bent substrate and the connecting members. It provides a stable, flat pressing surface that ensures uniform load distribution even when the underlying substrate is not perfectly flat, thereby maintaining manufacturing precision while allowing ease of mounting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively suppresses load deviations on semiconductor elements during the sintering process, preventing breakage and ensuring consistent bonding.
Implementation Method 1
a first member... has a Vickers hardness lower than a Vickers hardness of the first connecting member... The configuration effectively suppresses load deviations on semiconductor elements during the sintering process
Data Source
AI summary
A semiconductor device according to the present disclosure includes a first semiconductor element; a first connecting member; and a first member. The first semiconductor element has a first element obverse surface and a first element reverse surface that face mutually opposite in a thickness direction. The first semiconductor element also has a first electrode disposed on the first element obverse surface. The first connecting member is electrically connected to the first electrode. The first member overlaps with the first electrode as viewed in the thickness direction, has a Vickers hardness lower than a Vickers hardness of the first connecting member, and has electroconductivity.