Semiconductor Chip Sintering Recessed Plate Bonding

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Solution Overview

Problem

The curvature of the protective film or rubber under a sintering sheet during the transfer of a sintering material layer to a semiconductor chip results in a curved end of the sintering material layer, leading to poor bonding with the insulating circuit board, which can cause cracks and reduced bonding strength.

Innovation Solution

A recessed portion is formed on the conductive plate with a depth decreasing toward the outer periphery, allowing the curved sintering material layer to be embedded and bonded within this recess, preventing cracks and peeling, and enhancing the bonding area for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the sintering sheet is transferred using an elastic body and protective film, then the sintering material layer can be transferred to the semiconductor chip, but the curvature of the protective film or rubber causes the end of the sintering material layer to become curved, resulting in poor bonding

Engineering Contradiction:

Improvetransfer processVSAvoidflatness of sintering material layer

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

A recessed portion is formed in advance in the conductive plate at the position where the end of the sintering material layer is located. This preliminary structural preparation allows the curved end of the sintering material layer to be properly received and bonded, preventing the opening shape and ensuring complete bonding coverage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The curvature of the protective film or rubber, which causes the sintering material layer end to become curved, is not corrected but rather accommodated. The recessed portion in the conductive plate is specifically designed to receive this curved end, converting the harmful curvature effect into a beneficial fit that ensures complete bonding.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Ease of manufacture

If the curved end of the sintering material layer is bonded to the insulating circuit board, then bonding is achieved, but cracks are likely to be generated and bonding strength is reduced

Engineering Contradiction:

Improvebonding processVSAvoidbonding strength

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The recessed portion is formed in advance in the conductive plate to accommodate the curved end of the sintering material layer. This preliminary preparation ensures that the curved end is properly received and bonded without creating opening shapes, thereby preventing crack generation and ensuring bonding strength.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The curved end of the sintering material layer, which would normally cause bonding problems, is converted into a beneficial feature by designing the recessed portion to specifically receive and accommodate this curvature, ensuring complete bonding and preventing cracks.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Device complexity

If the sintering material layer is transferred with curved end, then the transfer process is simple, but the sintering material layer is likely to be separated from the insulating circuit board

Engineering Contradiction:

Improvetransfer processVSAvoidbonding strength

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The recessed portion is formed in advance in the conductive plate to accommodate the curved end of the sintering material layer. This simple preliminary structural preparation ensures that the curved end is properly received and bonded, preventing separation from the insulating circuit board while maintaining transfer process simplicity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The curved end of the sintering material layer, which would normally cause separation, is converted into a beneficial fit by designing the recessed portion to specifically receive this curvature, ensuring complete bonding and preventing separation while keeping the transfer process simple.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents the generation of cracks and peeling, increases the bonding strength, and enables efficient heat dissipation, resulting in a semiconductor device with high heat resistance and reliability.

Implementation Method 1

the sintering material is sintered by pressurization and heating to bond the insulating circuit board and the semiconductor chip

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS20230154882A1Semiconductor device and method for manufacturing the same

Publication Date: 2023.05.18 FUJI ELECTRIC CO LTD

AI summary

A semiconductor device includes: a semiconductor base body; a semiconductor chip; a sintering material layer bonded to a lower surface of the semiconductor chip and having a thickness decreasing toward an outer periphery of the semiconductor chip; and a conductive plate having a main surface facing the lower surface of the semiconductor chip and a recessed portion which the sintering material layer contacts in the main surface, the recessed portion having a depth decreasing toward the outer periphery of the semiconductor chip.