Semiconductor Device Slit Metal Pattern Insulating Resin

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Solution Overview

Problem

The intimacy of contact between epoxy resin and metal patterns in semiconductor devices leads to stress due to expansion and shrinkage, causing separation and reliability issues, and existing solutions like providing slits in the metal pattern increase manufacturing costs by requiring additional coating steps.

Innovation Solution

A semiconductor device design with slits in the metal pattern around mounted components allows intimate contact between the insulating resin and epoxy resin, limiting stress through the anchor effect and reducing the difference in linear expansion coefficients without the need for a coating film, thereby enhancing reliability while controlling manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ceramic is used as an insulating layer in the substrate to provide intimate contact with epoxy resin in slits, then the anchor effect is improved, but stress concentration occurs at the interface due to large difference in linear expansion coefficients, reducing device reliability

Engineering Contradiction:

Improvedevice reliabilityVSAvoidstress concentration at interface

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent introduces an insulating resin as an intermediary material between the epoxy resin and the metal pattern, replacing ceramic in the substrate. This insulating resin has a linear expansion coefficient closer to that of the epoxy resin, thereby reducing stress concentration at the interface while maintaining the anchor effect through intimate contact in the slits.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the material parameter (linear expansion coefficient) by substituting ceramic with insulating resin in the substrate. This parameter change reduces the mismatch with epoxy resin, thereby reducing thermal stress during heating cycles while preserving the structural function of the insulating layer.

Inventive Principle:

Principle #35Parameter changes

2Stress or pressure

If a coating film is applied between epoxy resin and ceramic to reduce stress, then interface stress is reduced, but manufacturing cost increases due to additional process steps

Engineering Contradiction:

Improveinterface stressVSAvoidmanufacturing cost

Core Design Contradiction:

Stress or pressureVSEase of manufacture

Solution Approach 1:

The patent extracts the coating film from the structure by eliminating the need for it. Instead of applying a separate coating film between epoxy resin and ceramic, the invention uses insulating resin as the base substrate material itself, which inherently provides stress reduction without requiring additional coating processes.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the functions of the substrate insulating layer and the stress-reducing coating into a single insulating resin layer. This eliminates the need for separate coating processes while achieving both electrical insulation and stress reduction simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

3Strength

If slits are provided in the metal pattern to produce anchor effect and prevent resin slippage, then resin anchoring is improved, but stress concentration occurs at the epoxy resin-ceramic interface

Engineering Contradiction:

Improveresin anchoring strengthVSAvoiddevice reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The insulating resin acts as an intermediary between the metal pattern with slits and the epoxy resin. It maintains the anchor effect by filling the slits and providing mechanical interlocking, while simultaneously reducing thermal stress through its compatible linear expansion coefficient, thereby improving both anchoring strength and device reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design secures the reliability of semiconductor devices by limiting stress at the interface between the epoxy resin and insulating resin, reducing the risk of separation and maintaining low manufacturing costs by eliminating the need for additional coating processes.

Implementation Method 1

the difference between the linear expansion coefficients of the epoxy resin and the insulating resin is reduced, thus enabling limiting of stress caused at the interface therebetween

Methodology Applied

Scientific EffectLinear expansion coefficient difference: Thermal Expansion

Implementation Method 2

The movement of the epoxy resin is limited by the anchor effect of the slit

Methodology Applied

Scientific EffectAnchor effect: Mechanical Fastener

Data Source

PatentUS9355999B2Semiconductor device

Publication Date: 2016.05.31 MITSUBISHI ELECTRIC CORP

AI summary

A semiconductor device includes: a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the metal pattern; and an epoxy resin encapsulating the metal pattern and the mounted component, wherein a slit is provided in the metal pattern around the mounted component, and the insulating resin exposed from the metal pattern and the epoxy resin are brought into intimate contact with each other in the slit.