Semiconductor Module Terminal Structure for Low-Inductance Snubber Connection
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Solution Overview
Problem
Conventional power semiconductor modules have long interconnection lengths between terminals and capacitors, leading to increased inductance and ringing issues during switching operations.
Innovation Solution
A semiconductor device design featuring a laminating wiring structure with snubber connecting portions on external terminals and capacitors placed inside the case, reducing inductance by minimizing the interconnection length between terminals and capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a capacitor is connected to terminals via a bus bar outside the case, then the capacitor can be easily connected, but the interconnection length increases and inductance increases
Solution Approach 1:
The capacitor is nested inside the case housing, with its terminals directly connected to the external terminals through conductive structures formed within the case. This nesting arrangement eliminates the need for external bus bars while maintaining easy connectability through integrated conductive paths.
Solution Approach 2:
The connection structure transitions from a external linear arrangement (bus bar outside case) to an internal three-dimensional integrated structure. The conductive portions are formed within the case volume, utilizing spatial arrangement to minimize interconnection length while maintaining manufacturing ease.
2Device complexity
If a capacitor is connected to terminals via a bus bar outside the case, then the connection structure is simple, but inductance increases causing ringing during switching operations
Solution Approach 1:
The capacitor and its connection structure are nested within the case, creating a compact integrated assembly. This reduces the loop area of current paths, thereby minimizing parasitic inductance and suppressing ringing during switching operations while maintaining structural simplicity.
Solution Approach 2:
The design converts the potential harm of long interconnection paths into benefit by integrating the capacitor inside the case with directly formed conductive connections. This transformation eliminates the inductance problem while maintaining manufacturing simplicity through the integrated structure.
3Length of moving object
If the capacitor is placed inside the case with direct terminal connection, then inductance is reduced, but the internal arrangement becomes more complex
Solution Approach 1:
The capacitor housing is merged with the case housing to form an integrated structure. The conductive portions are directly formed within the case, combining multiple functions (capacitor mounting, electrical connection, and structural support) into a unified arrangement that minimizes interconnection length without increasing overall complexity.
Solution Approach 2:
The case structure serves multiple functions: it houses the power semiconductor element, provides structural support, and integrates the capacitor mounting and electrical connection functions. This multi-functionality eliminates the need for separate bus bars and mounting structures, reducing interconnection length while maintaining design simplicity.
Data Source
AI summary
A semiconductor device includes: an isolation circuit board; a semiconductor chip provided on one main surface of the isolation circuit board; a first external terminal having a main surface and including a first snubber connecting portion rising from the main surface of the first external terminal, the first external terminal being electrically connected to the semiconductor chip; a second external terminal placed adjacent to the first external terminal, having a main surface facing the same direction as the main surface of the first external terminal, and including a second snubber connecting portion rising from the main surface of the second external terminal, the second external terminal being electrically connected to the semiconductor chip; and a capacitor having one end connected to the first snubber connecting portion and the other end connected to the second snubber connecting portion