Semiconductor Socket Movable Pedestal for Precise Contact Inspection
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Solution Overview
Problem
In semiconductor device assembly, the thermal history from heating processes can cause disconnection defects between wiring or via inside the substrate, making it difficult to detect disconnection defects between pre-stack lands and semiconductor chips during electric inspection, and existing inspection methods require high accuracy to avoid damaging solder resist or wiring.
Innovation Solution
A socket design with a movable pedestal and positioning pins that allows precise contact with both solder balls and pre-stack lands, ensuring accurate positioning and reducing the risk of damage during electric inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a contact pin is brought into contact with both solder ball and pre-stack land during electric inspection, then disconnection defects can be detected, but positioning accuracy must be extremely high to avoid damaging solder resist or wiring
Solution Approach 1:
The socket is divided into a body portion and a lid portion that can be separated. The contact pin is integrated into the lid portion, allowing the lid to be removed after inspection. This segmentation enables the contact pin to perform its inspection function without remaining in the device, thereby eliminating the risk of damaging solder resist or wiring during subsequent mounting processes.
Solution Approach 2:
The electric inspection using the contact pin is performed before the socket lid is removed and before the semiconductor device is mounted on the circuit board. This preliminary action ensures that the contact pin completes its inspection function at the appropriate stage, avoiding any potential damage to the device during later assembly steps.
2Ease of manufacture
If heating processes are used during assembly, then solder balls can be mounted, but thermal history causes disconnection defects in wiring or via inside substrate
Solution Approach 1:
The electric inspection process provides feedback on the condition of internal connections (wiring and via) after heating processes have been completed. By measuring electrical continuity through the contact pin during inspection, the system can detect disconnection defects that may have occurred during solder ball mounting, allowing defective devices to be identified and removed from further assembly.
Data Source
AI summary
To improve the reliability in an electric inspection of a semiconductor device. When a movable pedestal 15 is being positioned relative to an arrangement direction of a plurality of second contact pins 13a by a positioning pin 13b which a socket 12 includes, a substrate conduction test is performed by bringing a first contact pin 14a into contact with a pre-stack land 5c of a wiring substrate 5 and of the a lower package 2 and moreover bringing the second contact pin 13a into contact with a solder ball 7, and thus the electric inspection can be performed by precisely positioning the first contact pin 14a side and the second contact pin 13a side. Then, the reliability of the electric inspection can be improved.