Semiconductor Socket Presser Link Mechanism
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Solution Overview
Problem
The existing sockets for semiconductor devices can cause abrasion on the outer peripheral surface of the semiconductor package during mounting and demounting, leading to false defect identification and reduced yield due to the increased pressure on contact terminals.
Innovation Solution
A socket design with a presser member having a pressing surface parallel to the semiconductor device's contour surface, supported in the socket body to move vertically and brought into contact with the contour surface, utilizing a link mechanism synchronized with the cover member's motion to hold or release the semiconductor device without grinding, thus preventing abrasion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the presser member is brought into contact with the outer periphery of the semiconductor device to hold it, then the holding force is improved, but abrasion on the outer peripheral surface occurs
Solution Approach 1:
The pressing surface of the presser member is designed to be substantially parallel to the contour surface of the semiconductor device package, creating a localized contact configuration that distributes pressure evenly across the pressing surface rather than concentrating it at a single point. This local quality adjustment prevents abrasion while maintaining adequate holding force.
Solution Approach 2:
The presser member is configured to rotate about a rotation axis, transitioning between a pressed state (contacting the semiconductor device) and a released state (separated from the device). This dynamic mechanism allows the holding force to be applied only when necessary, reducing cumulative abrasion during repeated mounting and demounting operations.
2Reliability
If the presser member is pressed against the semiconductor device with increased pressure to improve holding reliability, then the holding reliability is improved, but abrasion on the outer peripheral surface increases
Solution Approach 1:
The pressing surface is designed with a specific orientation (substantially parallel to the contour surface) that distributes the pressing force across a larger contact area. This local quality configuration reduces pressure concentration, allowing adequate holding reliability to be achieved without excessive pressure that would cause abrasion.
Solution Approach 2:
The presser member operates in periodic cycles of pressing and releasing, corresponding to the mounting and demounting operations. This periodic action allows the holding reliability to be maintained during the pressed phase while minimizing cumulative abrasion through the released phase, where no contact occurs.
3Device complexity
If the presser member is designed to contact the outer periphery of the semiconductor device, then the holding mechanism is simplified, but abrasion occurs on the outer peripheral surface
Solution Approach 1:
The presser member's pressing surface is designed with a specific geometric configuration (substantially parallel to the contour surface) that maintains simplicity in the overall mechanism while preventing abrasion through proper contact distribution. This local quality design achieves both simplicity and abrasion prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The socket effectively holds the semiconductor device without imparting any abrasion on the outer peripheral surface, ensuring accurate testing and reducing false defect identification, thereby improving yield.
Implementation Method 1
a link mechanism coupled to the cover member and the presser member, for holding the pressing surface of the presser member on the contour surface of the semiconductor device or releasing the same therefrom in synchronization with moving up and down of the cover member
Implementation Method 2
a presser member having a pressing surface portion formed generally parallel to a contour surface of the semiconductor device and the presser member being supported in the socket body so that the pressing surface portion is moved in the direction vertical to the contour surface and brought into contact with the contour surface
Data Source
AI summary
A pressing surface portion of a presser member for selectively holding a semiconductor device is supported to be movable upward and downward in accordance with the up/down motion of a cover member to be close to or away from a alignment plate, as well as to be rotatable between a position directly above the alignment plate and a predetermined waiting position.