Semiconductor Socket Terminal Segmentation for Rapid Replacement
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Solution Overview
Problem
Densely arranged IC sockets on a printed wiring board require frequent replacement due to defects, which is costly and time-consuming, and existing solutions face challenges in adjusting spring constants to prevent excessive contact pressure on the board.
Innovation Solution
A semiconductor device socket with a socket body, contact terminals having elastic movable side pieces, a fixed side terminal with curved portions, and a slider mechanism that allows for easy replacement of defective sockets without soldering, ensuring appropriate contact pressure on the printed wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC sockets are densely disposed on a printed wiring board to improve inspection efficiency, then productivity is improved, but the complexity of replacement work increases and maintenance time increases when a defect occurs
Solution Approach 1:
The contact terminal is divided into a fixed terminal portion and a movable piece portion that can be separated from each other. The movable piece can be detached from the fixed terminal without damaging the printed wiring board, allowing rapid replacement of only the defective contact terminal rather than the entire IC socket assembly.
Solution Approach 2:
The movable piece is designed as a replaceable component that can be discarded when defective and replaced with a new one. The fixed terminal portion remaining on the printed wiring board is recovered and reused, eliminating the need to replace or damage the entire socket assembly or board.
2Reliability
If soldering is used to fix contact terminals to the printed wiring board, then reliability is improved, but the time required for replacement operation increases and the risk of board damage increases
Solution Approach 1:
The contact terminal is segmented into a fixed terminal portion attached to the board and a movable piece that can be independently replaced. This eliminates the need for soldering during replacement, as the movable piece can be simply attached and detached mechanically, dramatically reducing replacement time and risk.
Solution Approach 2:
The movable piece is designed as a disposable or easily replaceable component with a simplified attachment mechanism that does not require soldering. This allows rapid replacement without the time-consuming and risk-prone soldering process, while maintaining sufficient connection reliability for the application.
3Ease of manufacture
If the fixed terminal is made curved to improve ease of manufacture, then ease of manufacture is improved, but the spring constant becomes difficult to adjust, risking excessive contact pressure on the contact pad
Solution Approach 1:
The contact terminal is divided into a fixed terminal portion and a movable piece. The movable piece can be designed with optimized curvature and elastic properties independent of the fixed terminal's manufacturing constraints, allowing proper spring constant adjustment without compromising manufacturing ease of the fixed portion.
Solution Approach 2:
The spring constant can be adjusted by changing parameters of the movable piece such as its thickness, length, or curvature radius, while the fixed terminal portion maintains its manufacturing advantages. This separation allows independent optimization of both manufacturing ease and mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and easy replacement of defective IC sockets without soldering, preventing excessive contact pressure on the printed wiring board, thus reducing maintenance costs and improving inspection efficiency.
Implementation Method 1
a pair of movable side contact pieces, which are elastic and pinch a terminal of the semiconductor device
Implementation Method 2
the fixed side terminal having a plurality of curved portions formed to be continuous with each of the contact pieces and elastically displaceable in a direction orthogonal to the electrode surface of the wiring board
Data Source
AI summary
A contact terminal (26ai) comprises: a pair of movable side contact pieces (26M) and (26F) which pinch or release a ball-like electrode portion (DVa) of a semiconductor device (DV); a fixed side terminal (26T) having on one end a contact point (26te) coming into contact with an electrode group (PBE) of a printed wiring board (PB); and a fixing portion (26C) which connects proximal end portions of the pair of elastic movable side contact pieces (26M) and (26F) to the other end of the fixed side terminal (26T). The fixed side terminal (26T) formed into a curved shape is elastic and has the one end thereof joined to the fixing portion (26C). The fixed side terminal (26T) is formed of a plurality of curved portions (26ta, 26tb, 26tc, and 26td) and the contact point (26te) provided continuous with one another.