Semiconductor Substrate Solder Absorption Portion

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Solution Overview

Problem

In semiconductor devices, excessive joining material can overflow and cause short circuits, leading to increased wire length and thermal resistance due to the need for additional processing or recesses in the circuit board.

Innovation Solution

A semiconductor device configuration with a substrate featuring an element mount portion and a solder absorption portion that extends outward from the mount portion, having higher solder wettability than other areas, allowing surplus solder to flow away from bonding portions and preventing short circuits, while maintaining minimal wire length and solder thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the amount of joining material is increased to ensure proper mounting, then the reliability of the joint is improved, but the joining material may overflow to portions of the circuit board to which the wires are connected, resulting in a short circuit

Engineering Contradiction:

Improvejoint reliabilityVSAvoidshort circuit risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The harmful function of the solder absorption portion is extracted and separated from the bonding portions. The solder absorption portion is specifically designed to attract and absorb excess solder material, while the bonding portions are kept separate and protected from solder overflow, thus preventing short circuits while maintaining joint reliability

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The solder absorption portion acts as an intermediary between the element mount portion and the bonding portions. It intercepts and absorbs excess solder material before it can reach the bonding portions, serving as a protective barrier that prevents harmful interactions while allowing the mounting process to proceed

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If recesses are formed in the circuit board to prevent solder overflow, then short circuits are prevented, but the wire length increases and thermal resistance increases

Engineering Contradiction:

Improveshort circuit preventionVSAvoidwire length

Core Design Contradiction:

Object-affected harmful factorsVSLength of moving object

Solution Approach 1:

Instead of modifying the bonding portions or wire paths to prevent solder overflow, the harmful function is extracted by adding a dedicated solder absorption portion that actively manages excess solder material. This allows the wires to maintain their original short paths while still preventing short circuits

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The excess solder material, which would normally be a harmful overflow causing short circuits, is converted into a beneficial element by providing a designated absorption area. The solder is redirected to the absorption portion, turning the potential harm into a controlled feature that protects the bonding portions while maintaining efficient wire routing

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Object-affected harmful factors

If additional processing is performed to control solder flow, then short circuits are prevented, but the manufacturing complexity and time increase

Engineering Contradiction:

Improveshort circuit preventionVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The solder absorption portion is pre-formed on the circuit board before the mounting process. This preliminary preparation ensures that excess solder material is automatically directed to the absorption area during the normal mounting process, eliminating the need for additional complex processing steps or controls during manufacturing

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively suppresses short circuits, reduces wire length, and minimizes thermal resistance by directing excess solder to an absorption area, avoiding contact with bonding portions and maintaining efficient heat dissipation.

Implementation Method 1

a solder absorption portion 44 that extends outward from the element mount portion 42

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

having higher solder wettability than other areas

Methodology Applied

Scientific EffectSolder wettability: Wetting

Data Source

PatentUS20230138210A1Semiconductor device

Publication Date: 2023.05.04 DENSO CORP

AI summary

A semiconductor device includes a semiconductor element, a substrate, and a plurality of wires. The semiconductor element has a plurality of electrodes on a first surface. The substrate has an element mount portion to which a second surface of the semiconductor element is joined through a solder joining material, a plurality of bonding portions disposed on a periphery of the element mount portion and spaced apart from each other, and a solder absorption portion extending outwardly from the element mount portion to receive a surplus of the solder joining material and being electrically independent of the plurality of bonding portions. The wires connect the electrodes and the bonding portions. The element mount portion and the solder absorption portion have a higher solder wettability than another portion of the substrate.