Semiconductor Chip Solder Ball Silver Composition
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving optimal performance in both drop testing and thermal cycling testing due to limitations in solder ball composition and thermal expansion properties, which affect reliability.
Innovation Solution
The semiconductor device incorporates three regions with solder balls of different silver weight percentages and thermal expansion properties, ensuring distinct hardness and thermal expansion characteristics for improved reliability in drop testing and thermal cycling testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls with uniform composition are used across the entire chip, then manufacturing simplicity is maintained, but reliability in both drop testing and thermal cycling testing cannot be optimized simultaneously
Solution Approach 1:
The patent applies local quality by dividing the chip into multiple regions (first region, second region, third region) and assigning different solder ball compositions to each region. The first region contains solder balls with first composition, the second region contains solder balls with second composition, and the third region contains solder balls with third composition. This allows each region to be optimized for specific testing conditions (drop testing or thermal cycling testing) while maintaining overall device reliability.
Solution Approach 2:
The patent segments the chip into distinct regions with different solder ball compositions. By dividing the chip surface into multiple zones and applying different material compositions to each zone, the patent enables simultaneous optimization for multiple testing scenarios without requiring a single uniform composition that would compromise either performance metric.
2Strength
If solder balls with high silver content are used, then hardness is improved for drop testing, but thermal expansion mismatch increases affecting thermal cycling performance
Solution Approach 1:
The patent applies local quality by placing solder balls with high silver content (providing high hardness) in the first region optimized for drop testing, while placing solder balls with different composition in other regions optimized for thermal cycling testing. This allows each region to have the specific material properties needed for its intended testing scenario.
Solution Approach 2:
The patent changes the compositional parameters of solder balls across different regions. By varying the silver content and other alloying elements in different regions, the patent optimizes both hardness for drop testing and thermal expansion characteristics for thermal cycling testing, resolving the contradiction between these two performance requirements.
3Reliability
If solder balls with high thermal expansion are used, then thermal cycling reliability is improved, but drop testing performance deteriorates due to reduced hardness
Solution Approach 1:
The patent applies local quality by assigning solder balls with high thermal expansion properties to specific regions (second or third regions) optimized for thermal cycling testing, while assigning solder balls with high hardness to the first region optimized for drop testing. This spatial differentiation allows both performance requirements to be satisfied simultaneously in their respective regions.
Solution Approach 2:
The patent segments the chip into regions with different solder ball properties. By separating the chip into multiple zones with differentiated material characteristics, the patent enables the second region or third region to provide thermal cycling reliability through appropriate composition while the first region provides drop testing performance through high hardness composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device exhibits enhanced reliability in both drop testing and thermal cycling testing by utilizing solder balls with varying silver compositions and thermal expansion properties, specifically designed for each region of the semiconductor chip.
Implementation Method 1
second solder balls on the first region of the semiconductor chip and containing a second weight percent of silver greater than the first weight percent, and third solder balls on the second region of the semiconductor chip and containing a third weight percent of silver less than the first weight percent
Data Source
AI summary
A semiconductor device includes a semiconductor chip including a gate structure, the semiconductor chip having a first region and a second region that surrounds sides of the first region, first solder balls on the first region of the semiconductor chip and containing a first weight percent of silver, second solder balls on the first region of the semiconductor chip and containing a second weight percent of silver greater than the first weight percent, and third solder balls on the second region of the semiconductor chip and containing a third weight percent of silver less than the first weight percent.