Semiconductor Electrode Bonding Structure to Prevent Solder Bridging
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Solution Overview
Problem
Existing semiconductor devices face challenges with solder bridging between the semiconductor element and the conductive member, leading to electrical and mechanical issues.
Innovation Solution
The semiconductor device incorporates a semiconductor element with protective film portions and conductive member facing portions, where solder portions are separated by interposed film and conductive portions to prevent wetting and bridging during soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder portions are placed between the semiconductor element and conductive member for electrical connection, then electrical connectivity is achieved, but solder bridging occurs between adjacent electrodes
Solution Approach 1:
The patent divides the bonding structure by introducing discrete barrier portions (interposed film portions and interposed conductive portions) between adjacent solder portions. These barrier portions segment the continuous bonding interface into isolated regions, preventing solder from bridging between adjacent electrodes while maintaining individual electrical connections.
Solution Approach 2:
The patent introduces intermediary barrier portions (interposed film portions and interposed conductive portions) positioned between the semiconductor element and conductive member. These intermediaries act as physical barriers that prevent direct contact between adjacent solder portions, thereby preventing solder bridging while allowing electrical connection through the solder portions themselves.
2Strength
If solder portions are used to bond semiconductor element and conductive member, then mechanical strength is achieved, but stress concentration occurs in the solder
Solution Approach 1:
By segmenting the bonding interface with barrier portions, the patent distributes mechanical stress across multiple discrete bonding points rather than concentrating it in continuous solder regions. The barrier portions act as stress relief features that prevent stress accumulation in the solder material.
Solution Approach 2:
The barrier portions are positioned in advance between the semiconductor element and conductive member to preemptively prevent stress concentration in the solder. These intermediaries cushion and distribute applied stresses before they can concentrate in the solder portions, reducing the risk of crack initiation.
3Reliability
If continuous solder bonding is applied between semiconductor element and conductive member, then bonding coverage is maximized, but crack occurrence increases due to stress concentration
Solution Approach 1:
The patent segments the continuous solder bonding into discrete, isolated solder portions separated by barrier portions. This segmentation maintains adequate bonding coverage across the interface while preventing crack propagation that would occur in continuous solder structures under thermal and mechanical stress.
Solution Approach 2:
The barrier portions are positioned in advance to cushion and distribute stresses that would otherwise concentrate in continuous solder regions. This preemptive stress distribution prevents crack initiation and propagation, thereby extending the operational lifespan of the bonded structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the likelihood of solder bridging, minimizing stress concentration and preventing crack occurrence in the solder, thereby enhancing the reliability and lifespan of the semiconductor device.
Implementation Method 1
The at least one interposed film portion and the at least one interposed conductive portion are configured to be less likely wetted to the plurality of solder portions such that the at least one interposed film portion and the at least one interposed conductive portion avoid the plurality of solder portions in liquid phase entering into the space between the plurality of solder portions during soldering
Data Source
AI summary
A semiconductor device includes a semiconductor element, a conductive member, and solder portions. The semiconductor element includes first main electrodes and a protective film on a first main surface, and a second main electrode on a second main surface. The protective film has an interposed film portion between the first main electrodes. The conductive member has facing portions each facing a corresponding one of the first main electrodes and an interposed conductive portion disposed between the facing portions. The solder portions are disposed between the first main electrodes and the facing portions and separated away from each other by the interposed film portion and the interposed conductive portion to define a space between the solder portions. The interposed film portion and the interposed conductive portion are less likely wetted to the solder portions to avoid the solder portions in liquid phase entering into the space during soldering.