Semiconductor Solder Composition Matching Heat Areas
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in enhancing heat dissipation performance and reliability due to uniform solder thickness and the resulting thermal stress, which can lead to reduced heat dissipation and increased shrinkage cavities.
Innovation Solution
The semiconductor device employs a plurality of solders with varying compositions and concentrations, strategically disposed to match different heat generation and stress areas on the semiconductor chip, minimizing shrinkage cavities and optimizing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of solders is set different from each other depending on an area, then reliability is enhanced by moderating thermal stress, but thickness of solders may be partially increased which results in reduction of heat dissipation performance
Solution Approach 1:
The patent applies local quality by varying the composition and concentration of solders according to different joining areas on the semiconductor chip. Different regions with different heat generation characteristics are matched with solders having appropriate thermal conductivity and mechanical properties, thereby simultaneously improving reliability and maintaining heat dissipation performance without uniformly increasing solder thickness across all areas.
Solution Approach 2:
The patent changes the parameters of solders (composition and concentration) to optimize both reliability and heat dissipation. By adjusting the alloy composition ratios of different solder materials in different regions, the patent achieves moderate thermal stress while maintaining adequate thermal conductivity, thus resolving the contradiction between reliability enhancement and heat dissipation performance.
2Ease of manufacture
If uniform thickness of solders is used, then manufacturing is simplified, but thermal stress is not moderated resulting in reduced reliability
Solution Approach 1:
The patent implements local quality by assigning different solder compositions and concentrations to different joining areas based on their heat generation characteristics. This allows the manufacturing process to remain relatively simple while achieving differentiated solder properties in different regions, thereby moderating thermal stress and enhancing reliability without requiring complex variable thickness control.
3Reliability
If thickness of solders is increased to reduce thermal stress, then reliability is improved, but heat dissipation performance is reduced
Solution Approach 1:
The patent changes the compositional parameters of solders rather than uniformly increasing thickness. By adjusting the alloy composition and concentration ratios of different solder materials in different regions, the patent achieves stress moderation through material property differentiation while maintaining adequate thermal conductivity for heat dissipation, thus avoiding the heat dissipation penalty associated with increased solder thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance and reliability by reducing shrinkage cavities and thermal resistance, while matching solder properties with heat generation and stress areas, thereby improving the overall performance of the semiconductor device.
Implementation Method 1
The plurality of solders are disposed to correspond to the plurality of joining areas, respectively... enhancing heat dissipation performance... minimizing shrinkage cavities and optimizing thermal conductivity
Data Source
AI summary
A semiconductor device includes a substrate, a plurality of solders, and a semiconductor chip. The plurality of solders are located adjacent to each other. At least one of composition and concentration of the plurality of solders is different from each other. The semiconductor chip includes a joining surface to be joined to the substrate with the plurality of solders. The joining surface of the semiconductor chip includes a plurality of joining areas in which heat generation of the semiconductor chip or a stress on an object to be joined is different from each other. The plurality of solders are disposed to correspond to the plurality of joining areas, respectively.