Semiconductor Heat Dissipation via Non-Through Hole Solder Path

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Solution Overview

Problem

Existing semiconductor devices face challenges in miniaturization and productivity due to complex and costly heat dissipation configurations, where a through hole is required for a heat dissipating unit's projection, leading to wasted space and alignment issues during manufacturing.

Innovation Solution

A semiconductor device with a non-through hole heat dissipating path filled with conductive material, such as solder, which allows for efficient heat dissipation without the need for a projection, enabling simpler and cost-effective manufacturing and improved alignment during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a through hole is provided in the semiconductor element to insert a projection of the heat dissipating unit, then heat dissipation characteristics are improved, but the semiconductor element cannot be miniaturized due to wasted space in the through hole portion

Engineering Contradiction:

Improveheat dissipation characteristicsVSAvoidsize of semiconductor element

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

Instead of providing a through hole to insert a projection (conventional approach), the invention inverts the approach by providing a projection on the heat dissipating unit that fits into a recess formed on the semiconductor element. This inversion allows the heat dissipating unit to be securely attached while minimizing wasted space and enabling miniaturization of the semiconductor element.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The projection of the heat dissipating unit is nested into a recess formed on the semiconductor element. This nesting arrangement allows the heat dissipating unit to be integrated into the semiconductor element structure without requiring additional through hole space, thereby enabling miniaturization while maintaining effective heat dissipation.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Temperature

If a projection is provided in the heat dissipating unit to be inserted into a through hole, then heat dissipation characteristics are improved, but manufacturing becomes complicated and expensive requiring highly precise micromachining

Engineering Contradiction:

Improveheat dissipation characteristicsVSAvoidmanufacturing cost and complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The invention inverts the conventional approach by forming a recess on the semiconductor element and providing a projection on the heat dissipating unit, rather than the other way around. This inversion simplifies manufacturing because the recess can be formed using standard semiconductor fabrication processes, and the projection can be formed using conventional molding techniques, avoiding the need for highly precise micromachining.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The projection on the heat dissipating unit is designed to fit into the recess on the semiconductor element, allowing the components to self-align and self-assemble during manufacturing. This self-service mechanism reduces the need for complex alignment procedures and highly precise micromachining, thereby simplifying the manufacturing process and reducing costs.

Inventive Principle:

Principle #25Self-service

3Temperature

If a projection is provided in the heat dissipating unit to be inserted into a through hole, then heat dissipation characteristics are improved, but alignment during insertion becomes complicated reducing productivity

Engineering Contradiction:

Improveheat dissipation characteristicsVSAvoidproductivity during assembly

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The projection and recess are designed with asymmetric geometries that provide unique alignment features. This asymmetry ensures that the heat dissipating unit can only be inserted in the correct orientation, simplifying the alignment process during assembly and significantly improving productivity by eliminating the need for complex alignment procedures.

Inventive Principle:

Principle #4Asymmetry

4Temperature

If multiple projections are provided in the heat dissipating unit to be inserted into multiple through holes, then heat dissipation characteristics are improved, but alignment becomes even more difficult further degrading productivity

Engineering Contradiction:

Improveheat dissipation characteristicsVSAvoidproductivity during assembly

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The heat dissipating unit is divided into multiple segments or regions, each with its own projection that fits into a corresponding recess on the semiconductor element. This segmentation allows for modular assembly, where each projection-recess pair can be aligned and assembled independently, simplifying the overall alignment process and improving productivity even when multiple heat dissipation points are required.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each projection and its corresponding recess are designed with asymmetric geometries that provide unique alignment features. This asymmetry ensures that each component can only be inserted in the correct orientation, simplifying the alignment process during assembly and significantly improving productivity by eliminating the need for complex alignment procedures, even when multiple projections are involved.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat dissipation characteristics, reduces manufacturing costs, and increases productivity by eliminating the need for precise micromachining and complex alignment processes, while allowing for flexible placement of heat dissipating paths without increasing the semiconductor element's size.

Implementation Method 1

a heat dissipating path, the heat dissipating path being defined by a non-through hole in the first principal surface and formed by filling the non-through hole with a conductive material, and the heat sink is bonded to the semiconductor element with the conductive material disposed therebetween

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7928559B2Semiconductor device, electronic component module, and method for manufacturing semiconductor device

Publication Date: 2011.04.19 MURATA MFG CO LTD

AI summary

A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element is bonded to a heat sink with the conductive material disposed therebetween. Solder can be used as the conductive material, for example. By introducing molten solder into the non-through hole while having solder disposed between the semiconductor element and the heat sink, the heat dissipating path is provided and the heat sink is bonded to the semiconductor element.