Semiconductor Device Solder Outflow Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices, the second solder layer can overflow and establish electrical continuity with the semiconductor element, preventing normal operation due to their proximity.
Innovation Solution
Incorporating a solder outflow prevention part between the semiconductor element and terminal, configured to prevent the solder layers from overflowing, with a distance between the prevention part and the semiconductor element greater than the solder layer thickness, ensuring electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the semiconductor element and terminal are disposed in proximity to each other, then the device size is reduced, but the solder layer may outflow and establish electrical continuity between the terminal and semiconductor element
Solution Approach 1:
A solder outflow prevention part is introduced as an intermediary component between the semiconductor element and terminal. This prevention part physically blocks the solder layer from flowing between the terminal and semiconductor element, maintaining electrical isolation while allowing the component to be disposed in proximity for compact device size
Solution Approach 2:
The space between the semiconductor element and terminal is segmented by the solder outflow prevention part. This segmentation creates distinct zones that prevent solder from bridging the gap between components, enabling close spacing without compromising electrical isolation
Data Source
AI summary
A semiconductor device includes a substrate, a semiconductor element, a terminal and a solder outflow prevention part. The semiconductor element is fixed on one side of the substrate via a first solder layer. The terminal that is fixed on the one side of the substrate via a second solder layer. The solder outflow prevention part is formed between the semiconductor element and the terminal in the one side of the substrate and is configured to prevent the first solder layer and the second solder layer from outflowing. A distance between the solder outflow prevention part and the semiconductor element is longer than a thickness of the first solder layer.