Semiconductor Processing Composition With Solvent Ratio for Storage Stability

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Solution Overview

Problem

Existing semiconductor processing compositions suffer from storage stability issues due to chemical reactions caused by heating or long-term storage, leading to deterioration of processing characteristics and reduced manufacturing yield.

Innovation Solution

A composition comprising specific compounds represented by general formulas (1) and (2), with a defined ratio of MA/MB (1.0×10^2 to 1.0×10^6), along with a compound having amino groups or their salts, and a liquid medium, is used at controlled temperatures and rotation speeds to maintain stability and improve processing characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the composition is heated to 50°C to 65°C immediately before use to efficiently remove resist film or residue, then processing efficiency is improved, but storage stability deteriorates due to chemical reactions caused by heating or long-term storage

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidstorage stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The composition is divided into multiple components with distinct functions: compound (A) serves as the main solvent for resist removal, compound (B) acts as a stabilizing agent to prevent degradation during storage, and compound (C) provides additional cleaning capability. This segmentation allows each component to perform its specific function while maintaining overall composition stability during storage and effectiveness during use.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent specifies precise compositional parameters including the ratio of compounds (A), (B), and (C), purity requirements for each component, and pH range (6.0-8.0). By controlling these parameters, the composition maintains storage stability while ensuring processing efficiency when heated to 50-65°C. The defined parameter ranges prevent chemical degradation during storage while enabling effective resist removal and residue cleaning during processing.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If the composition is stored at near room temperature for long-term storage, then storage stability is improved, but processing characteristics deteriorate due to chemical reactions

Engineering Contradiction:
Improvestorage stabilityVSAvoidprocessing characteristics
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

Compound (B) acts as an intermediary or stabilizing agent that prevents direct harmful chemical reactions between compounds (A) and (C) during long-term storage at room temperature. This intermediary component maintains the integrity of the composition during storage while allowing the active components to function properly when the composition is heated and applied for processing, thus preserving both storage stability and processing characteristics.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The composition is formulated as a composite system combining multiple compounds with complementary properties. Compound (A) provides solvent action for resist removal, compound (B) provides stabilization during storage, and compound (C) enhances cleaning capability. This composite structure ensures that the composition maintains its processing characteristics even after long-term storage at room temperature, as each component compensates for potential degradation of others.

Inventive Principle:
Principle #40Composite materials

3Productivity

If heating is applied to improve resist film removal efficiency, then productivity increases, but composition stability decreases due to chemical reactions

Engineering Contradiction:
Improveresist film removal efficiencyVSAvoidcomposition stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The composition is prepared in advance with all necessary components properly mixed and stabilized before use. Compound (B) is pre-added to prevent chemical reactions during storage, and the composition is maintained within the specified pH range (6.0-8.0) and compositional parameters before heating. This preliminary preparation ensures that when the composition is subsequently heated to 50-65°C for resist film removal, it maintains stability while achieving high productivity.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12570929B2Composition for semiconductor processing and processing method
Publication Date: 2026.03.10 JSR CORPORATION
  • US12570929B2 patent drawing
  • US12570929B2 patent drawing

AI summary

A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106.RO(CH2)2O(CH2)2OH  (1)ROH  (2)(In the formula (1) and the formula (2), R's represent the same hydrocarbon group.)