Semiconductor Component Removal and Sorting Mechanism
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Solution Overview
Problem
Existing semiconductor component testing and handling systems face inefficiencies in removing and sorting tested components, particularly in ensuring correct orientation for packaging and re-testing, and managing different device speeds and waste disposal.
Innovation Solution
A device and method involving an actuating device to open and empty clamping carriers, an intermediate carrier for component transfer, data memory for sorting, and rotating devices to reorient components for correct packaging and re-testing, along with a buffer system for handling different device speeds and waste management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor components are removed from clamping carriers and sorted into categories, then productivity is improved through automated handling, but device complexity increases due to the need for removal devices, intermediate carriers, and sorting mechanisms
Solution Approach 1:
The system divides the clamping carrier into multiple segments with individual clamping elements that can be independently actuated. This segmentation allows selective release of components into different categories based on test results, enabling automated sorting without complex manual intervention while maintaining manageable system complexity through modular design
Solution Approach 2:
An intermediate carrier is introduced as a mediator between the clamping carrier and the final sorting destination. This intermediary component simplifies the overall system architecture by providing a temporary holding position that facilitates automated transfer and sorting operations, reducing the complexity of direct point-to-point mechanisms
2Ease of operation
If clamping carriers are emptied by rotating 180 degrees, then ease of operation is improved for component removal, but device complexity increases due to rotation mechanisms
Solution Approach 1:
Instead of complex rotation mechanisms to flip the clamping carrier, the system inverts the approach by using gravity and controlled dropping. The clamping carrier is tilted or positioned so components naturally fall away when clamps are released, eliminating the need for active rotation mechanisms while maintaining ease of operation through passive gravity-assisted removal
3Manufacturing precision
If test data is stored and retrieved for each semiconductor component, then manufacturing precision is improved through accurate sorting, but loss of time occurs during data retrieval operations
Solution Approach 1:
Test data is stored in memory associated with each clamping carrier or cassette before the components are physically removed. This preliminary data storage allows the sorting system to quickly retrieve and act on test results without time-consuming data collection during the removal process, maintaining high sorting accuracy while minimizing delays
Solution Approach 2:
The system replaces time-consuming manual data retrieval and component identification with automated optical or RFID reading systems. Data is read automatically as carriers are positioned, eliminating manual intervention and reducing retrieval time while maintaining precise sorting accuracy through automated data-processing-linkage
4Ease of operation
If semiconductor components are dropped onto intermediate carrier by gravity, then ease of operation is improved through simple emptying, but reliability decreases due to potential component damage or incorrect orientation
Solution Approach 1:
The intermediate carrier is designed with locally differentiated zones: soft cushioning areas for component reception to prevent damage, and oriented positioning features to ensure correct orientation. This local quality variation maintains reliability by protecting components during gravity-based transfer while keeping the overall emptying process simple and efficient
Solution Approach 2:
The intermediate carrier is pre-equipped with cushioning elements and orientation guides before components are dropped. This beforehand cushioning prevents impact damage and ensures correct orientation during the gravity-assisted transfer, maintaining component reliability without complicating the emptying operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient removal, sorting, and packaging of semiconductor components, ensuring correct orientation for conventional placement machines and re-testing, while managing device speed discrepancies and waste disposal effectively.
Implementation Method 1
Both the removal device and the rotating device have at least one suction needle with which a semiconductor component is held by creating a vacuum.
Implementation Method 2
After the clamping elements have been opened, the semiconductor components are released from the clamping carrier solely by gravity and fall into the intermediate carrier.
Data Source
Figure 1~3
Figure 4~6
AI summary
The invention relates to a device for removing tested semiconductor components from a clamping carrier with fixed stop elements and movable clamping elements pre-tensioned by spring elements. According to the invention, the device has the following features: • an actuating device arranged above the clamping carrier, which moves the clamping elements into an open position enabling the clamping carrier to be emptied and, after emptying, into a rest position; • an intermediate carrier positioned below the clamping carrier during emptying, onto which the clamping carrier is emptied; • a data storage device in which data for each semiconductor component is stored; and • a removal device that removes the semiconductor components from the intermediate carrier and sorts them into at least two different categories according to the data stored in the data storage device.