Semiconductor Chip Spacing via Vertex-Placed Spacers
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Solution Overview
Problem
The use of high-viscosity adhesives with spherical particles in semiconductor devices often results in uneven distribution of particles, leading to inadequate support and potential inclination of semiconductor chips relative to the substrate.
Innovation Solution
The semiconductor device employs spacers arranged at the vertices of a polygon surrounding the center of gravity of the semiconductor chip to regulate the distance between the chip and the substrate, ensuring even support and preventing inclination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-viscosity adhesives with spherical particles are used to fix the semiconductor chip, then the adhesive strength is improved, but the particle distribution becomes uneven leading to chip inclination
Solution Approach 1:
The patent extracts and removes the spherical particles from the adhesive composition. By eliminating the particle component entirely and using a pure viscous adhesive without fillers, the invention avoids the particle distribution problem while maintaining adhesive strength through the adhesive's inherent viscous properties
Solution Approach 2:
The patent changes the physical parameter of the adhesive by using a high-viscosity adhesive without particles. The viscosity parameter is optimized to provide sufficient adhesive strength while the absence of particles eliminates distribution unevenness, thereby preventing chip inclination
2Stability of the object's composition
If spherical particles are added to the adhesive to restrict chip inclination, then the chip positioning stability is improved, but the adhesive mixing difficulty increases
Solution Approach 1:
The patent removes the spherical particles from the adhesive system entirely. By using a particle-free viscous adhesive, the invention eliminates the mixing difficulty associated with incorporating and distributing particles uniformly, while still achieving chip positioning stability through the adhesive's viscous characteristics
3Strength
If the adhesive viscosity is increased to improve bonding strength, then the adhesive strength is improved, but the particle distribution uniformity deteriorates
Solution Approach 1:
The patent extracts and eliminates the spherical particles from the adhesive formulation. By using a pure viscous adhesive without any particulate fillers, the invention achieves high bonding strength through the adhesive's viscosity while completely avoiding particle distribution uniformity issues
Solution Approach 2:
The patent optimizes the adhesive's viscosity parameter to provide sufficient bonding strength while maintaining a particle-free composition. This parameter change ensures that the adhesive flows and bonds effectively without the complications of particle suspension and distribution
Data Source
AI summary
A semiconductor device includes: a substrate; a semiconductor chip disposed adjacent to a front surface of the semiconductor substrate; an adhesive fixing a back surface of the semiconductor chip to the front surface of the substrate; and a plurality of spacers disposed to regulate a distance between the substrate and the semiconductor chip. The spacers are bonded to the front surface of the substrate or the back surface of the semiconductor chip, and are located on respective vertexes of a polygon surrounding a center of gravity of the semiconductor chip.