Semiconductor Device SPI Data Routing for Camera Shake Correction
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Solution Overview
Problem
The existing semiconductor devices for camera shake correction in video and digital cameras face an increase in wiring complexity when using both optical image stabilizers (OIS) and electronic image stabilizers (EIS) together, as they require additional communication lines for data sharing.
Innovation Solution
The proposed semiconductor device transmits and receives data using an unused address of a gyro sensor via SPI communication, reducing the number of wirings needed by utilizing the existing communication infrastructure between semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If data sharing between two semiconductor chips is performed using SPI communication with a chip select signal line, then communication between chips is enabled, but the number of wirings increases
Solution Approach 1:
The gyro sensor's SPI interface is made multi-functional by allowing it to serve both its original function (providing gyro data to the first semiconductor chip) and an additional function (receiving data from the second semiconductor chip). The unused address space of the gyro sensor is utilized to create a shared communication channel, enabling one communication line to perform multiple data transmission tasks.
Solution Approach 2:
The gyro sensor acts as an intermediary device that facilitates data sharing between the first and second semiconductor chips. By using the gyro sensor's unused address space as a communication medium, data can be transmitted between chips without requiring direct chip-to-chip communication lines, thus reducing wiring complexity.
2Adaptability or versatility
If additional communication lines are added for data sharing between semiconductor chips, then data transmission capability is improved, but the device structure becomes more complex
Solution Approach 1:
The existing SPI communication infrastructure of the gyro sensor is made universal by enabling it to handle multiple communication tasks. The same SPI bus and address lines are used both for reading gyro data and for transmitting correction lens position information, eliminating the need for separate dedicated communication lines.
Solution Approach 2:
Multiple data transmission functions are merged into a single communication channel. The SPI interface originally designed for gyro data transmission is combined with an additional data sharing function between semiconductor chips, allowing two different data streams to share the same physical communication lines through address multiplexing.
Data Source
AI summary
A semiconductor device includes: a camera lens that controls an X axis, a Y axis, and a Z axis to perform camera shake correction; a first semiconductor chip that receives data of the X axis and the Y axis of the camera lens; a second semiconductor chip that receives data of the Z axis of the camera lens; and a gyro sensor that acquires camera shake state data, in which the second semiconductor chip is connected to the first semiconductor chip via a chip select signal line, a data signal line, and a clock signal line of SPI communication, and is connected to the gyro sensor via the chip select signal line, the data signal line, and the clock signal line of the SPI communication, and the second semiconductor chip transmits position data of the Z axis to a storage unit of the gyro sensor via the SPI communication.