Integrated Spray Nozzle for Semiconductor Etching and Rinsing

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Solution Overview

Problem

The existing semiconductor manufacturing processes face issues with residual etching liquid dripping on substrates due to nozzle and pipeline issues, leading to excessive etching, surface damage, reduced yield, and increased costs from corrosion and clogging, and require separate nozzles for deionized water and etching solution, causing controllability and positioning deviations.

Innovation Solution

A spraying device with a main channel and branch channels, allowing for controlled mixing and spraying of fluids directly onto the substrate, using valves and flow controllers to manage fluid flow and prevent residual chemicals from forming crystals and causing corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate nozzles are used for etching solution and deionized water, then the fluids can be sprayed independently, but positioning deviations and controllability issues occur

Engineering Contradiction:

Improvefluid spraying independenceVSAvoidpositioning accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent merges the etching solution nozzle and deionized water nozzle into a single integrated nozzle structure. This single nozzle can switch between spraying etching solution and deionized water, eliminating positioning deviations between separate nozzles while maintaining the ability to spray different fluids independently through valve control

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If deionized water is sprayed immediately after etching liquid, then excessive etching is prevented, but waiting time for nozzle replacement causes residual liquid to drip

Engineering Contradiction:

Improveetching controlVSAvoidnozzle replacement time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent implements preliminary action by pre-positioning both etching solution and deionized water delivery paths within the same nozzle structure. Valves are pre-configured to switch between fluids, allowing immediate transition from etching to rinsing without nozzle replacement time, thus preventing residual liquid dripping

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

By combining multiple fluid delivery capabilities into a single nozzle with integrated valve control, the system eliminates the time delay associated with nozzle replacement while maintaining the ability to switch between etching solution and deionized water immediately

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If pipelines are immersed in high-concentration etching solution for long time, then etching process is maintained, but corrosion and crystal clogging occur

Engineering Contradiction:

Improveetching process continuityVSAvoidpipeline durability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent implements continuous useful action by integrating a cleaning channel that continuously circulates cleaning solution through the etching solution pipeline. This continuous cleaning action prevents crystal deposition and corrosion while maintaining etching process continuity, as the cleaning occurs simultaneously with the etching operation

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The patent introduces a cleaning solution as an intermediary substance that flows through the etching solution pipeline. This intermediary cleaning solution prevents direct contact between etching solution and pipeline walls over extended periods, thereby preventing corrosion and crystal clogging while allowing continuous etching operation

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances process yield and reduces costs by preventing chemical dripping and clogging, ensuring consistent fluid application without separate nozzles, and optimizing the semiconductor manufacturing process efficiency.

Implementation Method 1

a main channel including a main channel inlet and a main channel outlet for gas to flow from the main channel inlet to the main channel outlet; and at least one branch channel is communicated with the main channel, and each of the at least one branch channel has a branch channel inlet provided for fluid to flow from the branch channel inlet to the main channel outlet

Methodology Applied

Scientific EffectFluid mixing:

Data Source

PatentUS20250325998A1Spraying device, spraying system and operating method thereof for semiconductor substrate

Publication Date: 2025.10.23 GRAND PROCESS TECH CORP

AI summary

A spraying device, a spraying system, and an operating method thereof for a semiconductor substrate are provided. The spraying device includes a main channel and at least one branch channel. The main channel has a main channel inlet and a main channel outlet provided for gas to flow from the main channel inlet to the main channel outlet. The at least one branch channel is communicated with the main channel, and each of the at least one branch channel has a branch channel inlet provided for fluid to flow from the branch channel inlet to the main channel outlet.