Semiconductor Sputtering Apparatus for Uniform Shield Layer Formation
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Solution Overview
Problem
Existing semiconductor manufacturing methods face challenges in uniformly forming metal films on both the upper and lateral faces of semiconductor packages to effectively shield electromagnetic noise without compromising the thickness of thin devices like smartphones.
Innovation Solution
A semiconductor manufacturing apparatus is designed with a carrier and target holder configuration that allows for the reciprocal movement of semiconductor packages under a magnet placement face, enabling the uniform formation of shield layers on both faces using sputtering, with specific magnet and target configurations to ensure excellent coverage and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal plate is used to shield electromagnetic noise from a semiconductor chip, then the shielding effectiveness is improved, but the device thickness increases
Solution Approach 1:
The patent replaces the traditional thick metal plate with a thin metal film formed by sputtering. This thin film maintains the electromagnetic shielding function while significantly reducing the thickness contribution, allowing thin devices like smartphones to achieve effective noise shielding without compromising their slim profile
Solution Approach 2:
The invention changes the physical state and form of the shielding material from a bulk metal plate to a deposited metal film. By controlling the film thickness and composition through sputtering parameters, the shielding effectiveness is maintained while the dimensional parameter (thickness) is optimized for thin device applications
2Length of moving object
If a metal film is formed by sputtering to shield electromagnetic noise, then the device thickness is reduced, but the uniformity of film coverage on lateral faces deteriorates
Solution Approach 1:
The patent introduces dynamic movement of the carrier holding semiconductor packages during the sputtering process. The carrier moves reciprocally in the vertical direction, allowing the metal film to be deposited uniformly on both upper and lateral faces of the packages. This dynamic approach ensures consistent film thickness and coverage across all surfaces without requiring complex multi-step processes
Solution Approach 2:
The invention adds the vertical movement dimension to the sputtering process. By moving the carrier up and down during deposition, the metal film can reach and coat lateral faces that would otherwise be shadowed or inaccessible. This dimensional change enables comprehensive coverage of all package surfaces including upper, lateral, and lower faces in a single continuous process
3Manufacturing precision
If the carrier moves during sputtering to improve film uniformity, then the coverage is enhanced, but the process time increases
Solution Approach 1:
The patent implements continuous sputtering deposition while the carrier moves reciprocally. The metal film deposition process continues uninterrupted during the carrier's vertical movement, ensuring that all surfaces (upper, lateral, and lower faces) receive uniform coating in a single continuous operation. This eliminates the need for separate deposition steps for different surfaces, maintaining high efficiency while achieving comprehensive coverage
Solution Approach 2:
The carrier movement pattern is pre-programmed to optimize film deposition on all package surfaces. By establishing the reciprocal motion sequence before deposition begins, the system ensures that upper, lateral, and lower faces are all exposed to the sputtering flux in the optimal sequence, achieving uniform coverage without requiring multiple separate processing steps or extended total process time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high degree of uniformity and coverage of shield layers on semiconductor packages, reducing thickness fluctuations to approximately 10% and enhancing sputtering efficiency, thereby effectively shielding electromagnetic noise while maintaining device thinness.
Implementation Method 1
it is discussed that the electromagnetic noise generated from the semiconductor chip is shielded by forming a metal film on the surface of the semiconductor package by sputtering or the like
Implementation Method 2
a magnet placement face on which one or more first magnetic-pole portions having first polarity and one or more second magnetic-pole portions having second polarity that is different from the first polarity are placed
Data Source
AI summary
In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.