3D Semiconductor Stack Heat Dissipation via Dummy Metal Bumps
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Solution Overview
Problem
Heat dissipation in multi-chip stack semiconductor packages remains a challenge, as existing solutions like external cooling methods are inadequate in preventing overheating, which can lead to component malfunction.
Innovation Solution
A heat dissipation structure utilizing dummy conductive components, such as dummy metal structures and bumps, is integrated into the semiconductor device to efficiently transfer thermal energy from the semiconductor die to ambient air without affecting device performance, using vapor deposition methods and passive surfaces for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multi-chip stack package is used to increase circuitry density, then functionality and miniaturization are improved, but heat generation increases causing overheating and component malfunction
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional packaging materials and creates a separate heat dissipation structure. This structure includes a heat dissipation layer with through-holes that extend from the first surface to the second surface of the substrate, allowing heat to be extracted and dissipated independently from the circuitry function.
Solution Approach 2:
The patent introduces an intermediary heat dissipation structure between the semiconductor devices and the ambient environment. This structure includes a heat dissipation layer with through-holes that serve as a thermal pathway, and thermal conductive material filling these holes to facilitate heat transfer from the high-density circuitry to the external environment.
2Stability of the object's composition
If molding compound or CTE match layer is used to fill gaps in three dimensional structure, then structural integrity is improved, but heat dissipation is blocked causing heat to be trapped inside the package
Solution Approach 1:
The patent applies local quality by creating through-holes in the heat dissipation layer that provide localized thermal pathways. The thermal conductive material is selectively placed in these through-holes to create regions of high thermal conductivity, while the surrounding molding compound maintains structural integrity. This allows different regions of the package to have different functional properties.
Solution Approach 2:
The patent uses composite materials by combining molding compound for structural support with thermal conductive material for heat dissipation. The composite structure consists of the substrate, heat dissipation layer with through-holes, thermal conductive material filling the holes, and molding compound surrounding these features, creating a multi-functional package structure that simultaneously provides mechanical strength and thermal management.
3Temperature
If external cooling methods such as adding fan are implemented, then heat dissipation is partially improved, but device complexity and reliability issues increase
Solution Approach 1:
The patent implements self-service by integrating the heat dissipation function directly into the package structure itself, eliminating the need for external cooling devices. The heat dissipation layer with through-holes and thermal conductive material creates an intrinsic thermal management system that passively dissipates heat without requiring additional active cooling components, thereby reducing device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively dissipates heat generated within the semiconductor device, preventing overheating and potential malfunctions by creating a heat dissipation channel that efficiently transfers heat into the ambient environment through the dummy bumps and structures.
Implementation Method 1
A heat dissipation structure utilizing dummy conductive components, such as dummy metal structures and bumps, is integrated into the semiconductor device to efficiently transfer thermal energy from the semiconductor die to ambient air
Implementation Method 2
using vapor deposition methods and passive surfaces for heat dissipation
Data Source
AI summary
A semiconductor structure includes a three dimensional stack including a first semiconductor die and a second semiconductor die. The second semiconductor die is connected with the first semiconductor die with a bump between the first semiconductor die and the second semiconductor die. The semiconductor structure includes a molding compound between the first semiconductor die and the second semiconductor die. A first portion of a metal structure over a surface of the three dimensional stack and contacting a backside of the second semiconductor die and a second portion of the metal structure over the surface of the three dimensional stack and configured for electrically connecting the three dimensional stack with an external electronic device.