3D Semiconductor Stack With Metal Ball I/O for Simpler Chip Bonding
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Solution Overview
Problem
The challenge in the semiconductor industry is to develop a cost-effective method for producing 3D stack packages that simplify the process complexity while maintaining high functionality and high-speed signal transmission in electronic components.
Innovation Solution
A semiconductor structure featuring a conductive structure with a stack of metal balls as I/O paths, where each first chip is bonded to a second chip with a metal bonding structure and dielectric material, and the metal balls are stacked on an outer pad extending beyond the chip, reducing process complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to produce 3D stack packages, then electrical connection between chips is achieved, but process complexity increases and manufacturing costs rise
Solution Approach 1:
The patent divides the conductive connection structure into discrete metal balls that are stacked vertically to form conductive columns. Each metal ball serves as an independent conductive element, segmenting the overall conduction path into manageable units that simplify the bonding process and reduce manufacturing complexity while maintaining electrical connectivity between chips.
Solution Approach 2:
The patent transitions from planar 2D chip arrangements to 3D vertical stacking by stacking metal balls in the vertical dimension. This dimensional change enables higher density interconnections and more efficient signal transmission paths without increasing the chip footprint, thereby reducing overall system complexity and cost.
2Reliability
If complex bonding processes are used to achieve reliable chip connections, then connection reliability improves, but manufacturing time and cost increase
Solution Approach 1:
The metal balls are pre-formed and pre-positioned on the outer pads before chip bonding occurs. This preliminary preparation of conductive structures eliminates the need for complex post-bonding alignment and connection processes, ensuring reliable electrical connections while significantly improving manufacturing efficiency and reducing production time.
Solution Approach 2:
The stacked metal balls inherently provide both mechanical support and electrical conduction functions through their simple stacked configuration. This self-service structure eliminates the need for additional complex bonding materials or multi-step connection processes, achieving reliable connections through the inherent properties of the metal ball stack itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces process complexity and saves costs by using a stack of metal balls as I/O paths, enabling efficient electrical signal transmission between chips while maintaining high functionality and high-speed performance.
Implementation Method 1
The conductive structure disposed on the outer pad includes a stack of a plurality of metal balls
Implementation Method 2
each first chip has an active side and an opposite side disposed opposite to each other. The second chip includes a chip bonding portion
Data Source
AI summary
A semiconductor structure and a method for fabricating the same are provided. The semiconductor structure includes a first chip, a second chip and a conductive structure. The first chip has an active side and an opposite side disposed opposite to each other. The second chip includes a chip bonding portion and an outer pad, and the outer pad is located outside the chip bonding portion. The first chip is disposed on the chip bonding portion of the second chip with the active side. The conductive structure is disposed on the outer pad, and the conductive structure includes a stack of a plurality of metal balls. The stack extends from the outer pad beyond the opposite side of the first chip.