Semiconductor Stack Pressure Distribution via Recessed Contact Plate
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Solution Overview
Problem
Existing semiconductor devices experience uneven pressure distribution on the end surface of a stack composed of semiconductor modules and coolers, which can lead to inefficient heat transfer and potential damage due to pressure concentration at the center.
Innovation Solution
A semiconductor device design that utilizes a single spring with a recessed contact plate, where the spring contacts the center portion of the plate perpendicular to the stacking direction, allowing the sides to pressurize the stack and reducing pressure unevenness by avoiding direct contact at the center, or alternatively, a contact plate with a cavity to distribute pressure more evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a plate spring is used to pressurize the stack, then the stack is pressurized in the stacking direction, but the pressure distributes unevenly on the end surface with high pressure at the center and low pressure at the ends
Solution Approach 1:
A contact plate is introduced as an intermediary component between the plate spring and the stack. The contact plate has a recessed portion at its center that contacts the plate spring, while the peripheral portion contacts the stack's end surface. This intermediary structure transforms the concentrated central force into distributed peripheral pressure, achieving uniform pressure distribution across the stack's end surface.
Solution Approach 2:
Instead of having the plate spring directly contact the center of the stack's end surface (which causes pressure concentration), the design inverts the contact arrangement by having the plate spring contact the center of the contact plate, which then transfers force to the peripheral portions of the stack's end surface. This inversion of the force transmission path achieves uniform pressure distribution.
2Stress or pressure
If two types of plate springs are used to pressurize the stack, then pressure concentration at the center can be reduced, but the device complexity increases
Solution Approach 1:
The function of multiple plate springs (first and second plate springs in prior art) is merged into a single plate spring combined with a contact plate. The contact plate with its recessed portion enables one plate spring to achieve the pressure distribution effect that previously required two different plate springs, thereby reducing device complexity while maintaining uniform pressure distribution.
Solution Approach 2:
The contact plate serves multiple functions: it acts as a force distribution element, a structural connector between the spring and stack, and a pressure equalization mechanism. This multi-functional component replaces the need for multiple specialized springs, simplifying the overall device structure while achieving uniform pressure distribution.
3Device complexity
If pressure is concentrated at the center of the end surface, then the spring structure is simple, but heat transfer efficiency decreases and potential damage occurs
Solution Approach 1:
The contact plate with recessed portion serves as an intermediary that preserves the simplicity of the single spring structure while eliminating its harmful effect of pressure concentration. The recessed portion design enables the simple spring structure to distribute pressure uniformly, thereby maintaining heat transfer efficiency and preventing damage without increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces pressure unevenness on the end surface of the stack, enhancing heat transfer efficiency and preventing damage from pressure concentration, while minimizing the likelihood of grease flow from heat radiation plates.
Implementation Method 1
The spring may be a type which pressurizes the stack by being inserted between the stack and a support portion of a casing housing the stack, or may be a type which pressurizes the stack by holding the stack from both sides thereof, similarly to a clip
Data Source
AI summary
A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.