Semiconductor Package Stacked Memory Controller Bonding
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Solution Overview
Problem
Highly integrated semiconductor chips are difficult to achieve due to technological limitations and are costly, hindering the processing of high-volume data in semiconductor products.
Innovation Solution
A semiconductor package design featuring a substrate with a first memory chip and a controller chip stacked on different portions, connected by bonding wires, allowing for direct electrical connections and reduced signal transmission paths, along with additional memory chips stacked in offset configurations for enhanced data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If highly integrated semiconductor chips are implemented in a single package, then data processing capability is improved, but manufacturing cost increases and integration technology requirements become more stringent
Solution Approach 1:
The patent divides the semiconductor package into multiple separate chips (first memory chip, controller chip, second memory chip) that are mounted on a substrate rather than integrating all functions into a single chip. This segmentation allows each chip to be manufactured independently using existing fabrication processes, reducing manufacturing complexity and cost while still achieving high-volume data processing through the multi-chip configuration.
Solution Approach 2:
The patent transitions from a single-plane integration approach to a three-dimensional stacked configuration where memory chips are positioned above and below the substrate, and the controller chip is mounted on the substrate. This vertical stacking in the Z-dimension enables higher integration density without requiring more complex planar manufacturing processes, thus improving data processing capability while maintaining ease of manufacture.
2Productivity
If multiple memory chips are stacked on the substrate, then integration density is improved, but signal transmission path length increases
Solution Approach 1:
The substrate serves as an intermediary platform that provides direct electrical connections between the first memory chip, controller chip, and second memory chip through bonding pads and conductive structures. This intermediary substrate enables short signal paths between stacked chips without requiring long external connections, thus achieving high integration density while minimizing signal transmission path length.
3Reliability
If direct bonding wires connect memory chips with controller chip, then electrical resistance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is pre-configured with bonding pads and conductive structures at specific locations before the chips are mounted. This preliminary preparation of connection points on the substrate simplifies the subsequent chip mounting and wire bonding processes, as the connection locations are already predetermined and marked, thereby reducing the precision requirements during the actual bonding operation while still achieving low electrical resistance through direct connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces electrical resistance and improves performance by direct signal transmission between chips and the substrate, enabling efficient data processing and flexibility in semiconductor packages.
Implementation Method 1
At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire.
Data Source
AI summary
Provided are semiconductor packages and electronic systems including the same. A first memory chip may be stacked on a first portion of a substrate. A controller chip may be stacked on a second portion of the substrate, which is different from the first portion. At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire.