3D Semiconductor Package Stacking With Side-Surface Pads
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high-density, efficient, and thermally stable stacking of semiconductor devices, which is essential for advancing electronic devices.
Innovation Solution
The proposed solution involves a package structure with a substrate and semiconductor devices stacked over it, where at least one semiconductor device has pads on its side surface, and a coupling structure is used to interconnect the devices and substrate, allowing for efficient electrical routing and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor devices are stacked vertically to increase density, then stacking density is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent introduces side surface pads as a new dimensional interface for electrical connections, transitioning from traditional top-surface only connections to multi-surface connections. This dimensional change enables better thermal and electrical pathway distribution in 3D stacked architectures, addressing thermal management challenges while maintaining high density.
2Adaptability or versatility
If more connection points are added to semiconductor devices, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The patent segments the connection interface into multiple independent pads distributed across different surfaces (top surface and side surfaces) of the semiconductor devices. This segmentation allows electrical connections to be established at multiple discrete locations, improving connectivity flexibility while keeping each individual pad structure simple and manageable.
3Productivity
If side surface pads are added to semiconductor devices, then electrical routing efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The side surface pads are formed as part of the semiconductor device fabrication process before stacking, with predetermined positions and configurations. This preliminary formation of pads with precise positioning integrated into the manufacturing flow enables subsequent stacking and connection operations to proceed with standard precision requirements, rather than requiring ultra-precise alignment during assembly.
Data Source
AI summary
In some aspects, a package structure includes a substrate and semiconductor devices stacked over the substrate. The semiconductor devices are stacked along a first direction, and at least one of the semiconductor devices comprises one or more pads located on a side surface of the at least one of the semiconductor devices.