Semiconductor Package Stiffness Layer Warpage Reduction
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Solution Overview
Problem
The use of organic substrates in semiconductor packages leads to warpage effects, which disrupts coplanarity and hampers the performance of proximity communication due to their lower hardness compared to ceramic substrates.
Innovation Solution
Incorporating a stiffness layer on the organic substrate to increase its hardness, thereby reducing warpage and ensuring good coplanarity, the semiconductor package includes a chip subassembly with at least a first, second, and third chip stacked in a specific orientation for proximity communication, utilizing capacitive or inductive coupling for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic substrate is used in the semiconductor package, then cost is reduced, but warpage effect occurs leading to poor coplanarity
Solution Approach 1:
The patent applies composite materials by combining the organic substrate with a stiffness layer to create a composite structure. This composite substrate maintains the cost advantage of organic materials while gaining the dimensional stability and coplanarity characteristics of rigid materials through the added stiffness layer.
Solution Approach 2:
The patent changes the physical parameters of the substrate by introducing a stiffness layer with specific mechanical properties (high modulus of elasticity). This parameter change transforms the substrate from a flexible, warpage-prone organic material to a rigid, coplanar structure suitable for proximity communication requirements.
2Manufacturing precision
If a ceramic substrate is used to maintain coplanarity, then coplanarity is achieved, but cost increases
Solution Approach 1:
Instead of using expensive ceramic substrates, the patent creates a composite structure using inexpensive organic substrate combined with a stiffness layer. This composite approach achieves the same coplanarity performance as ceramic substrates while maintaining the cost advantages of organic materials.
Solution Approach 2:
The patent replaces expensive ceramic substrates with a cost-effective organic substrate reinforced by a stiffness layer. This substitution achieves comparable functional performance (coplanarity) at lower cost, making the solution economically viable for mass production.
3Manufacturing precision
If the organic substrate hardness is increased to reduce warpage, then coplanarity improves, but the substrate becomes more complex
Solution Approach 1:
The patent segments the substrate system into two distinct functional layers: the organic substrate providing cost advantages and electrical properties, and the stiffness layer providing mechanical support and coplanarity. This segmentation allows each layer to perform its specialized function while keeping the overall structure relatively simple.
Solution Approach 2:
The composite substrate structure combines two materials with complementary properties: the organic substrate offers cost-effectiveness and electrical characteristics, while the stiffness layer provides mechanical rigidity. This functional division simplifies the design compared to using a single complex material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stiffness layer effectively reduces warpage on the organic substrate, maintaining coplanarity and enabling efficient proximity communication by enhancing the structural integrity and alignment of chips, thus overcoming the limitations of using organic substrates.
Implementation Method 1
Incorporating a stiffness layer on the organic substrate to increase its hardness, thereby reducing warpage and ensuring good coplanarity
Implementation Method 2
The two chips communicate by capacitive coupling, in which transmitters drive a plate of metal on one chip that couples to a corresponding plate of metal on the other chip
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes an organic substrate, a stiffness layer, and a chip subassembly. The stiffness layer is formed on the organic substrate. The chip subassembly is disposed on the stiffness layer. The chip subassembly includes at least a first chip, a second chip, and a third chip. The second chip is disposed between the first chip and the third chip in a stacked orientation. The first chip, the second chip, and the third chip have the function of proximity communication.