Semiconductor Storage Device Laser Marking Protection
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Solution Overview
Problem
Micro SD cards face design and manufacturing challenges due to size constraints and the need for reliable product development, including the risk of damage from laser marking processes used for printing logos and identification codes, which can affect the memory chip.
Innovation Solution
The semiconductor storage device design incorporates a lead frame to protect the memory chip during laser marking on the terminal surface, allowing for the printing of logos and codes without damaging the chip, and uses a combination of laser and ink marking processes to optimize printing areas and reduce the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser marking is performed on the terminal surface to print logos and identification codes, then printing functionality is improved, but the memory chip may be damaged by the laser
Solution Approach 1:
The marking process is segmented into two distinct phases: first, the lead frame protects the memory chip during initial laser marking on the terminal surface; second, the resin body protects the lead frame during subsequent laser marking on the non-terminal surface. This segmentation allows laser marking to be performed without direct exposure to sensitive components.
Solution Approach 2:
The lead frame is positioned to cover the memory chip before the laser marking process begins. This preliminary protective action ensures that when laser marking is performed on the terminal surface, the memory chip is already shielded, preventing potential damage while allowing the marking to proceed.
2Area of stationary object
If laser marking is performed on the non-terminal surface, then printing area is expanded, but the lead frame may be damaged
Solution Approach 1:
The resin body is formed to cover the lead frame before the second laser marking process begins. This preliminary protective action ensures that when laser marking is performed on the non-terminal surface, the lead frame is already shielded by the resin, preventing damage while expanding the printable area.
3Manufacturing precision
If the memory chip is exposed during laser marking, then marking precision is improved, but the chip reliability deteriorates
Solution Approach 1:
The marking process is divided into two stages with different protection levels: the terminal surface is marked with the memory chip protected by the lead frame, and the non-terminal surface is marked with the lead frame protected by the resin body. This segmentation allows precise marking while maintaining chip reliability through appropriate protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of Micro SD card manufacturing by protecting the memory chip during marking processes and enabling efficient printing on both terminal and non-terminal surfaces, improving product design and manufacturing efficiency.
Implementation Method 1
laser marking on a terminal surface of the resin
Implementation Method 2
printing of logos and identification codes by laser marking
Data Source
AI summary
According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.