Semiconductor Storage Device Thermal Plate Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor storage devices face challenges in efficiently dissipating heat generated during high-speed data processing operations, particularly from components like memory ICs and controllers, leading to increased temperatures and potential malfunctions due to inadequate heat release through existing wiring.
Innovation Solution
Incorporation of plate-shaped members with thermal and electrical conductivity, such as metal components, which are strategically positioned to connect with the substrate and holder, providing alternative heat dissipation paths and electromagnetic shielding, thereby facilitating efficient heat release and preventing temperature accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high load is applied to memory ICs and controller ICs to increase processing speed, then productivity is improved, but temperature increases leading to potential malfunctions
Solution Approach 1:
A plate-shaped member with thermal conductivity is introduced as an intermediary heat dissipation component between the substrate and the case. This plate-shaped member provides a dedicated thermal pathway that mediates heat transfer from the memory IC and controller IC to the case, resolving the contradiction by enabling high-speed operation while controlling temperature through the intermediary thermal conduction path.
2Loss of energy
If existing wiring is used for heat dissipation, then device complexity is minimized, but heat release efficiency is insufficient
Solution Approach 1:
The plate-shaped member serves multiple functions simultaneously: it acts as a heat dissipation path, provides electromagnetic shielding, and structurally connects the substrate to the case. By making one component multi-functional, the invention improves heat release efficiency without proportionally increasing device complexity, as the plate-shaped member integrates several protective and thermal management roles.
3Temperature
If plate-shaped members are added for heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The invention merges the heat dissipation function with electromagnetic shielding and structural support functions into a single plate-shaped member. By combining these functions that would otherwise require separate components, the thermal management effectiveness is improved while the increase in device complexity is minimized through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from high-speed operating components, reducing the risk of malfunctions and improving the overall performance and reliability of semiconductor storage devices by providing enhanced thermal management and electromagnetic shielding.
Implementation Method 1
the first plate-shaped member is connected to the holder at a first end, is connected to the first principal surface on a second end portion side of the substrate at a second end, and has thermal conductivity
Implementation Method 2
Incorporation of plate-shaped members with thermal and electrical conductivity, such as metal components, which are strategically positioned to connect with the substrate and holder, providing alternative heat dissipation paths and electromagnetic shielding
Data Source
AI summary
A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.