Semiconductor Storage Thermal Via Heat Dissipation
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Solution Overview
Problem
Solid state drives face challenges in heat dissipation, particularly when non-volatile memory devices are mounted adjacent to controllers, leading to undesired temperature increases that can result in data loss and reduced reliability, especially in compact and ultra-thin designs where additional heat dissipation members are not feasible.
Innovation Solution
Incorporating a circuit substrate with a first thermal via in the connection tab and a second thermal via in the main body, both made of conductive materials like copper or aluminum, to dissipate heat generated by the controller away from the non-volatile memory device, thereby preventing temperature rises and reducing data loss without the need for external heat dissipation members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If non-volatile memory devices are mounted adjacent to controllers to achieve high integration, then device integration is improved, but temperature increase occurs leading to data loss and reduced reliability
Solution Approach 1:
The patent segments the heat dissipation function by providing separate thermal vias for different heat sources. First thermal vias are dedicated to dissipating heat from the controller, while second thermal vias dissipate heat from the non-volatile memory device. This segmentation prevents heat from one component from affecting the other, allowing high integration while maintaining reliability.
Solution Approach 2:
The patent introduces thermal vias as intermediary heat dissipation structures between the heat-generating components and the heat sink. These thermal vias act as mediators that conduct heat away from the controller and memory devices through the substrate to external heat sinks, enabling close mounting of components without direct heat transfer between them.
2Temperature
If additional heat dissipation members are added to improve heat dissipation, then temperature control is improved, but device complexity and size increase
Solution Approach 1:
The patent merges the heat dissipation function with the existing substrate structure by forming thermal vias within the substrate itself. Instead of adding separate external heat dissipation members, the substrate is designed to incorporate thermal management functionality, combining structural support and thermal conduction into a single integrated component.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for mounting components, establishes electrical connections through conductive paths, and dissipates heat through integrated thermal vias. This multi-functionality eliminates the need for separate dedicated heat dissipation components, reducing overall device complexity while maintaining effective thermal management.
3Ease of manufacture
If thermal via is provided only in the connection tab to dissipate heat, then manufacturing simplicity is improved, but heat dissipation effectiveness is insufficient for multiple heat sources
Solution Approach 1:
The patent applies local quality by providing different thermal via configurations in different regions of the substrate. The connection tab region contains first thermal vias optimized for controller heat dissipation, while regions near non-volatile memory devices contain second thermal vias optimized for those components. Each region's thermal via structure is tailored to its specific heat generation characteristics and thermal management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat generated by the controller to the main board, preventing temperature increases in the non-volatile memory device and enhancing the reliability and compactness of solid state drives by improving heat dissipation properties without requiring additional heat dissipation components.
Implementation Method 1
a first thermal via in the connection tab and comprising a conductive material... configured to dissipate heat from a first semiconductor chip of a first type mounted on the first chip mounting region of the main body. The first thermal via may be configured to channel heat from the first semiconductor chip away from a second semiconductor chip of a second type mounted on the second chip mounting region.
Data Source
AI summary
A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.