Power Semiconductor Module Stress-Reducing Adjustment Element
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Solution Overview
Problem
Power semiconductor modules experience detachment of conductor tracks from insulating bodies due to differential thermal expansion coefficients between connection elements and substrates, leading to instability during continuous operation and production processes.
Innovation Solution
The power semiconductor module incorporates a substrate with a first and second metallic layer forming conductor tracks, where a first matching element is materially bonded to the connection element and a second matching element is connected to the substrate or cooling device using a connecting means, distributing thermal loads across two connections to prevent detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection elements with high electrical conductivity are used, then electrical performance is improved, but thermal expansion mismatch causes conductor track detachment
Solution Approach 1:
The patent introduces matching elements as intermediary components between the connection element and the conductor track. These matching elements have thermal expansion coefficients that are intermediate between those of the connection element and the substrate, thereby reducing the differential thermal expansion stress and preventing conductor track detachment while maintaining electrical connectivity.
Solution Approach 2:
The patent changes the thermal expansion parameter by selecting materials for the matching elements with specific thermal expansion coefficients that differ from both the connection element and the substrate. This parameter optimization reduces the thermal stress differential and prevents detachment during thermal cycling.
2Device complexity
If single connection between connection element and conductor track is used, then device complexity is reduced, but thermal load concentration causes detachment during continuous operation
Solution Approach 1:
The patent segments the thermal load path by introducing matching elements that create additional connection interfaces. Instead of a single direct connection between the connection element and conductor track, the path is divided into multiple segments (connection element to matching element, matching element to conductor track), distributing the thermal stress across multiple points.
Solution Approach 2:
The patent adds a dimensional aspect to the connection structure by inserting matching elements that extend the connection path in the vertical dimension. This creates a multi-layered connection architecture that distributes thermal loads across different spatial levels rather than concentrating them at a single interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents conductor track detachment from the insulating body by distributing thermal loads across two connections, enhancing the resilience and stability of the module during continuous operation and production.
Implementation Method 1
detachment of the conductor track from the insulating body due to differential thermal expansion coefficients between connection elements and substrates
Implementation Method 2
distributing thermal loads across two connections to prevent detachment
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
The module has a substrate (2) arranged on a cooling device or a base plate. A power semiconductor component (30) is electrical conductively connected with strip conductors (220, 222). An adjustment element (50) and a connector (60) are arranged on the strip conductors. A major surface of the adjustment element is fixed adjacent to the connector such that two connection types are formed while another major surface of the adjustment element is electrical conductively and firmly bonded by a connection unit (70), where the latter major surface is fixed adjacent to one of strip conductors. The connector is designed as load and auxiliary connectors.