Semiconductor Stress Modeling for Interconnect Coverage Boundaries
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor chips experience varying interconnect coverages leading to stresses that can separate or damage conductors and insulators, necessitating effective stress analysis during design to mitigate these issues.
Innovation Solution
A stress analysis method involving dividing the semiconductor chip's surface into small rectangles, calculating interconnect coverage, and integrating adjacent regions based on evaluation values to generate a finite element model, allowing for accurate stress modeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the semiconductor chip surface is divided into many small rectangles for stress analysis, then the measurement precision and boundary accuracy between regions with different interconnect coverages is improved, but the device complexity and computational load increases
Solution Approach 1:
The semiconductor chip surface is divided into multiple small rectangular regions, each with uniform interconnect coverage characteristics. This segmentation allows for precise boundary definition between regions with different interconnect coverages, enabling accurate stress analysis at region interfaces while maintaining manageable computational complexity through systematic organization of the divided regions
Solution Approach 2:
Each divided rectangular region is assigned specific interconnect coverage properties and stress characteristics appropriate to its local area. This local quality approach allows the analysis model to capture spatial variations in interconnect coverage and resulting stresses, improving measurement precision at boundaries while keeping each individual region's computational requirements simple
2Measurement precision
If the semiconductor chip surface is divided into small rectangles for stress analysis, then the measurement precision and boundary accuracy between regions with different interconnect coverages is improved, but the analysis time increases
Solution Approach 1:
The chip surface is segmented into small rectangular regions with uniform interconnect coverage, enabling precise boundary identification between regions with different coverage levels. This segmentation strategy achieves high measurement precision at region boundaries while maintaining efficient computational processing through the systematic structure of the divided regions
Solution Approach 2:
The analysis method changes parameters by dividing the continuous chip surface into discrete rectangular regions with defined interconnect coverage values. This parameter transformation enables precise boundary detection between regions of different coverage while facilitating efficient computational analysis through the discrete, structured nature of the divided regions
Data Source
AI summary
In general, according to one embodiment, a stress analysis method comprising: dividing a surface of an object into a plurality of first rectangles each having a first size, on data; and acquiring a first type value for each of the first rectangles. The method further includes: specifying, from among the first rectangles, a plurality of second rectangles that have the first type value of a magnitude that falls within a first range and form a rectangle; and generating a stress model for a set of the second rectangles by using the second rectangles as an element.