Semiconductor Stress Detection Circuit Using Self-Diagnosis
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Solution Overview
Problem
Existing electronic circuits and semiconductors in critical applications face safety challenges due to mechanical stress, which can lead to coupling effects and inaccurate stress compensation, especially when operating conditions exceed defined ranges, potentially causing dangerous failures.
Innovation Solution
A detection circuit with a stress monitor module and activation signal generator that monitors mechanical stress levels and generates warnings or triggers safety measures when criteria are met, using resistance or piezo-resistance measurements to maintain stress safety criteria and prevent semiconductor failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If stress compensation measurement circuitry is used to correct stress evoked signals, then measurement accuracy is improved within normal operating range, but the system becomes complex and costly with additional measurement circuitry and stress sensors
Solution Approach 1:
The semiconductor circuit performs self-diagnosis by utilizing its own stress evoked signals to detect mechanical stress. The circuit compares its output signal characteristics against stored reference values to automatically determine stress levels, eliminating the need for external stress sensors and measurement circuitry. This self-service approach maintains measurement accuracy while significantly reducing system complexity.
Solution Approach 2:
The existing output signal of the semiconductor circuit serves dual purposes: its primary function for the intended application and a secondary function as a stress indicator. By analyzing changes in the output signal characteristics, the circuit simultaneously performs its main function and detects mechanical stress, eliminating the need for separate dedicated stress measurement components.
2Measurement precision
If stress compensation is applied to Hall sensors or bandgap references, then stress evoked signals are corrected, but the correction fails when operating range is exceeded significantly leading to wrong calculations
Solution Approach 1:
The circuit performs preliminary detection of mechanical stress levels by monitoring output signal characteristics before they can lead to incorrect calculations. By continuously comparing current signal characteristics against stored reference values and detecting deviations, the system identifies stress conditions in advance and can take corrective action or alert the user before compensation fails.
Solution Approach 2:
The system implements feedback by continuously monitoring the output signal characteristics and comparing them against reference values. When stress-induced deviations are detected, the feedback mechanism allows the circuit to adjust its operation or trigger warnings, ensuring accurate operation within the valid range and preventing wrong calculations when stress exceeds compensation capabilities.
3Reliability
If separate substrates are used to avoid coupling effects between blocks, then independence is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of using separate physical substrates to achieve block independence, the patent substitutes a mechanical/physical separation approach with an electrical/software-based solution. The blocks remain on the same substrate but are electrically isolated through dedicated signal paths and processing, achieving independence through circuit design rather than physical separation.
Solution Approach 2:
The semiconductor circuit is segmented into functionally independent blocks that process signals through separate paths. Each block has dedicated input and output connections that prevent signal coupling between blocks, achieving independence through functional segmentation rather than physical substrate separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively detects mechanical stress and triggers safety measures, such as switching off components or transferring systems to a safe state, reducing the risk of semiconductor failures and maintaining system safety even when stress levels exceed critical thresholds.
Implementation Method 1
In some embodiments the detection circuit may monitor the stress by means of at least a resistance or a piezo-resistance measurement at the semiconductor circuit
Data Source
AI summary
Embodiments provide a circuit, a method, and a computer program configured to detect mechanical stress and a circuit, a method, and a computer program configured to monitor safety of a system. The detection circuit is configured to detect mechanical stress of a semiconductor circuit. The detection circuit comprises a stress monitor module configured to monitor mechanical stress of the semiconductor circuit and to provide monitor information related to a mechanical stress level of the semiconductor circuit. The detection circuit further comprises an activation signal generator configured to generate an activation signal comprising activation information related to the mechanical stress level of the semiconductor circuit if the monitor information indicates that a mechanical stress level criterion is fulfilled by the semiconductor circuit.